ADLINK NuPRO-E47: PICMG 1.3 13th Generation Core Industrial SHB

Onboard M.2: PCIe Gen4 x4 (occupying 4 PCIe channels)

Back panel gold fingers:

PCIe x16 (configurable as x16 or 2xx8, based on fork mode)

PCIe x4 (independent channel)

4 x PCI (via PCIe to PCI bridge chip)

2. Operating system compatibility

Microsoft Windows: Full support for Windows 10 64 bit and Windows 11 64 bit.

Linux: Officially supports Ubuntu 20.04.06 LTS and can be adapted to other mainstream distributions.

3. BIOS

Adopting AMI ®  UEFI BIOS， Based on 256 Mbit SPI Flash Memory, supports UEFI 2. x, Secure Boot secure boot, and TPM 2.0.

Heat dissipation design and working environment

1. Heat dissipation scheme

LGA1700 socket supports CPU heat sinks of different heights:

1U CPU heat sink: suitable for 1U/2U ultra-thin chassis, low profile design, and matched with forced air cooling.

2U CPU heat sink: suitable for standard 2U and above chassis, with larger heat dissipation area and better passive heat dissipation capability.

2. Environmental specifications

Working temperature: 0 ° C to 60 ° C (requires appropriate heat dissipation scheme and chassis air duct design).

Storage temperature: -40 ° C to 80 ° C.

Relative humidity: 5% to 95%, no condensation.

Certification: Compliant with CE and FCC Class A standards.

Key upgrade comparison with the previous generation product (NuPRO-E43)

Features: NuPRO-E43, NuPRO-E47 Upgrade Range

CPU Intergenerational 6/7 Core (Skylake/Kaby Lake) 12/13 Core (Alder/Raptor Lake) Cross generational Upgrade, Performance Multiple Times Improved

CPU socket LGA1151 LGA1700 architecture fully updated

Memory DDR4 2133/2400, maximum 32GB DDR5 4800, maximum 64GB bandwidth+50%, capacity doubled

M. 2 does not support M.2 M-Key PCIe Gen4 x4 with newly added high-speed storage interface

USB 3.2 Gen2 is not supported (only USB 3.0). I/O bandwidth doubles after 3 × 10Gbps

SATA 4 x SATA 3.0 6 x SATA 3.0 storage expansion+50%

Network I219LM (1GbE)+I225-V (2.5GbE) I225-V+I225-LM (dual 2.5GbE) Full 2.5GbE, dual port high-speed

DIO does not support 8-bit input+8-bit output. Added industrial DIO

Display VGA+DVI-D HDMI+DVI-D+VGA, add 4K HDMI

TPM SLB 9665XT2.0 SLB 9670XQ2.0/VQ2.0 updates TPM chip

Best Practices for Application Scenarios

Scenario 1: Edge AI Visual Inspection System

A certain electronic manufacturing AOI (Automatic Optical Inspection) equipment needs to simultaneously process real-time images from four high-resolution industrial cameras (connected via USB 3.2 Gen2 x1) and run a defect detection model based on deep learning. NuPRO-E47 is equipped with Core ™  I7-13700E processor (16 cores, 5.1GHz) and 64GB DDR5 memory, split x16 into 2xx8 using PCIe fork, and install two AI acceleration cards (such as Intel Arc GPU or NVIDIA RTX A-series) to achieve parallel inference acceleration. M. 2 Gen4 x4 NVMe SSDs are used for model storage and image caching, while 6 x SATA RAID 5 arrays enable long-term storage of large-scale historical data. The dual 2.5GbE network ports are respectively connected to the factory MES network and remote maintenance channel.

Scenario 2: Multi channel real-time data acquisition and control system

A certain semiconductor testing equipment needs to synchronously collect up to 8 high-speed analog signals (via PCIe data acquisition card) and control the multi axis motion platform in real time. The four COM ports (including two RS-422/485) of NuPRO-E47 are used to connect distributed I/O modules and environmental sensors. The DIO interface directly controls alarm lights and access switches, and the HDMI output is connected to a 4K HMI touch screen to display real-time waveforms and system status. The powerful PCIe channel resources of the Q670E chipset ensure the bandwidth requirements for multiple high-speed acquisition cards to work simultaneously.

Scenario 3: Vehicle/Rail Transit Information and Control System

The information entertainment and monitoring system (PIS) of a certain train needs to operate stably in a wide temperature and vibration environment, while supporting remote monitoring. Choose Core ™  I3-13100TE (4-core, 35W TDP) paired with a 2U radiator, meets the requirements for fanless cooling in vehicles. Dual 2.5GbE network ports (I225-LM supports AMT) combined with wireless gateways to achieve real-time transmission of train operation data and remote ground diagnosis. The onboard SEMA management cooperates with AMT to enable operation and maintenance personnel to perform system status queries, log extraction, and necessary remote maintenance on the ground.

Key points of engineering deployment

Backplane compatibility verification: NuPRO-E47 is a PICMG 1.3 standard SHB and must be compatible with a backplane that complies with PICMG 1.3 specifications. Before deployment, it is necessary to verify the PCIe gold finger signal definition of the backplane to ensure that the selected fork mode (x16 or 2xx8) is consistent with the physical slot of the backplane.

Memory selection: Only supports DDR5 4800 MHz non ECC UDIMM. Using RDIMM, ECC, or memory with mismatched frequencies will cause the system to fail to start. The maximum capacity is 64GB (32GB x 2).

CPU heatsink installation: LGA1700 socket needs to be installed with even force. The 1U/2U heat sink requires the use of cooling pads of a specified height to ensure sufficient contact between the CPU Die and the heat sink. Thermal conductive silicone grease should be evenly applied in a thin layer to avoid bubbles.