Today, with the acceleration of Industry 4.0 and intelligent manufacturing, edge computing nodes need not only powerful computing power, but also flexible display expansion, high bandwidth real-time communication and broad power supply adaptability. The MVP-5200 series launched by ADLINK is a value based fanless embedded platform designed for the next generation of industrial automation scenarios. It is equipped with the 12th generation Intel ® Core ™ Processor (Alder Lake), R680E chipset, supporting DDR5 memory, four-way independent 4K display, three-way 2.5GbE time sensitive network (TSN), and 9V~32V ultra wide voltage input, perfectly suited for complex applications such as machine vision, multi screen monitoring, motion control, and vehicle/outdoor.
Differences between Model Matrix and Core Hardware
The MVP-5200 series consists of four sub models, mainly divided by processor performance:
MVP-5209:Intel ® Core ™ I9-12900E (16 cores, 65W, turbo 5.0GHz) - Top Performance
MVP-5207:Intel ® Core ™ I7-12700E (12 cores, 65W, turbo 4.8GHz)
MVP-5207T:Intel ® Core ™ I7-12700TE (12 cores, 35W, turbo 4.6GHz) - Low power version
MVP-5205T:Intel ® Core ™ I5-12500TE (6-core, 35W, turbo 4.3GHz)
The entire series uses FCLGA1700 sockets, paired with Intel ® R680E chipset, supports 4 x DDR5 SO-DIMM slots, maximum capacity of 128GB, frequency of 3600MHz. Compared to the previous generation DDR4, the bandwidth has increased by about 50%, making it particularly suitable for large-scale image caching and complex algorithm operations.
The R680E chipset also provides vPro/AMT support (specific models) for remote management and security monitoring. TPM 2.0 is standard to ensure system integrity.
External I/O interfaces: quad display, tri network, multi serial port
The MVP-5200 series arranges all external interfaces on the front and right sides (see Figures 3-1 and 3-2), greatly simplifying on-site wiring and maintenance through single-sided operation.
1. Display output
Provide 2 x DisplayPort++and 2 x HDMI, supporting four independent displays, with the maximum resolution as follows:
DP1/DP2:4096× 2304@60Hz
HDMI1/HDMI2:3840× 2160@60Hz
Four display output is very suitable for production line monitoring centers, multi station HMIs, and digital signage scenarios, and can be achieved without the need for an external independent graphics card.
2. Network communication
Onboard 3 x Intel I225-LM 2.5GbE ports, supporting TSN (Time Sensitive Network), including IEEE 802.1AS precise time synchronization and 802.1Qav traffic shaping, which is crucial for motion control or robot collaboration that requires deterministic low latency. The three network ports can be configured as redundant links or load balancing to enhance network reliability.
3. USB and serial port
4 x USB 3.2 Gen 2 (10Gbps)+2 x USB 3.2 Gen 1 (5Gbps), both located on the front panel, meet the needs of high-speed cameras and data transfer.
4 x COM port (DB9): COM1/2 supports RS-232/422/485 software switching (BIOS settings), COM3/4 is fixed to RS-232. There is also COM5/6 reserved for needle arrangement, which can be customized and expanded.
4. Digital I/O and Audio
8-way DI+8-way DO (non isolated): The electrical specifications are the same as MVP-5100/3100 (input high level 2~5.25V, low level 0~0.8V; output open drain MOSFET, 24mA driving capability), and can be directly connected to sensors or actuators.
Audio interface: Provides Line in and Line out (based on TEMPO 92HD91), which can be used for voice alarm or human-computer interaction.
5. Antenna and power supply
6 x SMA antenna ports: ANT1-4 are dedicated to 5G modules, while ANT5-6 are used for WiFi 2.4GHz/5GHz.
DC power input: Supports 9V~32V ultra wide voltage, suitable for various power environments such as vehicle (24V), energy storage (12V), or industrial sites (24V).
Internal expansion: Three M.2 channels and dual SIM cards
The MVP-5200 provides extremely rich expansion options internally (see Figure 3-11/3-12 motherboard layout):
M.2 Socket 1(Key E,2230):PCIe Gen3 x1, Suitable for WiFi/Bluetooth modules.
M.2 Socket 2(Key B,3052/3042):PCIe Gen3 x1 + USB3 + SIM, Specially designed for 5G cellular modules, supporting dual Micro SIM card slots to achieve operator redundancy.
M.2 Socket 3(Key M,2280):PCIe Gen3 x4, Supports NVMe SSD for ultimate storage performance.
In addition, the onboard 2 x SATA III 6Gb/s interface can accommodate two 2.5-inch hard drives/solid-state drives (SSDs), and the entire machine supports RAID (implemented through R680E). Internally, it also provides a USB 2.0 Type-A interface for encryption dongles or system authorization modules; 12V fan connector (PWM control) for optional fan kit; I ² C bus (two channels, 3.3V/5V levels) is used for external sensors; And the 12V power pin provides additional power supply for the AFM MxM carrier board.
Detailed Hardware Installation Guide (Graphic and Text Steps)
The manual provides a large number of illustrations to introduce the installation process of key components, which is of great reference value for on-site maintenance: