ADLINK cPCI-6860A Dual Xeon Single Board Computer Deployment Guide

ADLINK cPCI-6860A Dual Xeon CompactPCI Single Board Computer Hardware Deployment and System Optimization Guide

In the fields of telecommunications infrastructure, data center servers, and high reliability industrial computing, the 6U CompactPCI platform has always held a key position due to its robust modular design, hot swappable capability, and long lifecycle support. The cPCI-6860A series single board computer (SBC) launched by ADLINK is equipped with single/dual Intel ®  Xeon ™  Processor, paired with Intel ®  The E7501 chipset and up to 4GB of registered ECC DDR memory provide powerful computing throughput. The corresponding rear wiring module cPCI-R6860A further expands storage (Ultra 320 SCSI, dual ATA 100) and network (additional dual Gigabit Ethernet) capabilities, and can be optionally equipped with IPMI v1.0 substrate management controller (BMC) for remote monitoring and out of band management. This article will provide a complete practical reference for system integration engineers from multiple dimensions, including hardware architecture, installation steps, interface definition, jumper configuration, driver deployment, and common troubleshooting.

Product positioning and technical specifications overview

CPCI-6860A complies with the PICMG 2.0 R3.0 core specification and is compatible with hot swappable (PICMG 2.1), packet switched backplane (PICMG 2.16), and optional system management (PICMG 2.9). The board size is 6U dual slot width (8HP), supporting Xeon processors in FC-MPGA2-604 and INT-MPGA-603 packages. A single channel can support up to 3.06GHz (533MHz FSB), while dual channels recommend low-voltage Xeon 1.6/2.0GHz to ensure controllable heat dissipation and power consumption.

Core computing and chipset:

The processor integrates 512KB L2 cache and a front-end bus of 400/533MHz;

Intel ®  E7501 Memory Control Hub (MCH) is equipped with ICH3-S Southbridge and P64H2 PCI/PCI-X bridge to provide high bandwidth internal interconnection;

Two DDR DIMM slots (144 bits wide, supporting ECC), registered with PC-1600 memory, with a maximum capacity of 4GB (OEM version can be expanded to four slots of 8GB, but requires additional slots).

Network and Storage:

Onboard Intel ®  82546EB Dual Port Gigabit Ethernet Controller (133MHz/64 bit PCI-X), capable of selecting front out or back out via jumper (supports PICMG 2.16);

An additional 10/100Mbps Fast Ethernet (ICH3 integrated MAC+82562EM PHY) is located on the front panel;

Two additional gigabit ports, one Ultra 320 SCSI interface (LSI 53C1020), and two ATA 100 IDE channels (supporting 2.5-inch HDD and CompactFlash) can be expanded through RTM.

Display and I/O:

ATI Rage XL graphics chip (8MB SDRAM), providing front and rear VGA outputs (up to 1280 × 1024);

Two USB 1.1 ports (front panel), the other two are rear output;

Two RS-232 serial ports (COM1 front panel, COM2 rear output), PS/2 keyboard/mouse (both front and rear);

Hardware monitoring and watchdog timer (Winbond W83627HF).

Optional BMC: Supports IPMI v1.0, enabling remote power control, sensor reading, and event logging through a dedicated management serial port (MGMT).

Hardware installation steps and key precautions

1. CPU installation

The board supports single or dual configuration. Must strictly adhere to:

Single channel: The CPU can only be installed in CPU1 slot (refer to Figure 7 in the manual), and it is strictly prohibited to install it in CPU0, otherwise the system cannot start.

Dual channel: It is necessary to use low-voltage Xeon processors of the exact same model and frequency (such as dual 1.6GHz or dual 2.0GHz), and do not mix CPUs of different specifications, otherwise it may damage the chip or board.

When installing, align the golden triangle of the CPU with the triangular mark on the socket, gently place it in, and press down the locking rod.

2. Installation of thermal module (radiator and fan)

Due to the high power consumption of Xeon processors (forced air cooling is required for single 2.4GHz or dual low-voltage channels), a dedicated thermal module must be installed. Steps:

Fix two fans onto the heat sink with long screws;

Install insulating O-rings on the six pillars at the bottom of the heat sink (to avoid contact with onboard components and secure the BMC card);

Align the thermal module with the fixed hole of the board and lock it with six screws from the back;

Connect the fan power cable to the corresponding interface (FAN1/FAN2) on the board and secure the cable with zip ties to prevent it from hooking during insertion and removal.

3. BMC card installation (optional)

If a BMC sub card is purchased, it must be inserted before installing the thermal module. Align the BMC card with the socket on the board, paying attention to the foolproof notch, and press it down vertically until it is fully inserted. The BMC card will be compressed by the O-ring of the thermal module to ensure reliable contact.

4. Memory installation

The memory must be installed in pairs, with two identical capacities, densities, and bit widths. Supports 64/128/256/512Mbit pellets, with a maximum single capacity of 2GB (double-sided), and a maximum total capacity of 4GB for two slots. If only one or a combination of plugs are inserted, the system will not start. When installing, first open the slot buckle, align it with the foolproof groove and insert it vertically. If you hear a crisp buckle sound, it will be locked.