Nordson DAGE4000 Bond Tensile Tester

Region cutting principle:

Equipped with a wide blade cutting knife (the width can cover the entire row of solder balls, for example, 5mm width covers 15 0.35mm solder balls).

Set the cutting height to 50% of the original height of the solder ball and advance horizontally at a constant speed (usually 0.5mm/s).

The sensor records the total force value during the entire shearing process and divides it by the number of solder balls to obtain the average single ball shear force.

This test can quickly screen for batch consistency, especially suitable for sampling inspection on production lines.

Compliant with standards: All the above tests meet the requirements JEDEC JESD22-B117A（BGA bump shear）、MIL STD 883（die shear, wire pull, stud pull） And ASTM F1269 (ball bond sheet).

Summary of Technical Specifications and Compliance

For the convenience of engineers to quickly evaluate whether the equipment meets their own process requirements, the following are the core technical parameters and compliance certifications of the Noxin DAGE 4000.

6.1 Mechanical System Specifications

Parameter indicators

Dimensions (width x depth x height, including joystick and forearm support) 425mm x 730mm x 670mm

Equipment weight 45kg

XY worktable stroke 220mm (X) × 220mm (Y)

The maximum Y-axis thrust of the workbench is 100kg (standard), with an optional 200kg; the maximum X-axis thrust is 5kg

Z-axis travel 65mm

Z-axis maximum test speed 5mm/s

Z-axis maximum tension/thrust 10kg (5mm/s in tension mode)

Total system accuracy ± 0.25% full-scale deflection (selected load range)

Maximum load sensor accuracy/repeatability 0.01% (100ppm), certified by UKAS

The overall ball shear Z positioning accuracy is ± 1 μ m (laser verification)

6.2 Requirements for Power and Gas Sources

Power supply: 100/110V or 220/240V AC, 50/60Hz switchable.

Air source (for automatic workbench or clamping): 4 bar clean and dry air, plastic tube outer diameter 6mm/inner diameter 4mm.

Vacuum source (for workpiece adsorption): minimum 500mm Hg.

6.3 Compliance with International Standards

Equipment manufacturing strictly follows:

ISO 9001:2008 Quality System

European CE directives: EMC Directive (2004/108/EC), Low Voltage Directive (2006/95/EC), Machinery Safety Directive (2006/42/EC)

RoHS (2002/95/EC) Hazardous Substance Restrictions

Simultaneously meet the following industry testing standards:

Cold ball drawing: JEDEC JESD22-B115A, EIAJ ET-7407

BGA bump cutting: JEDEC JESD22-B117A

Golden ball cutting: ASTM F1269

Gold wire drawing: MIL STD 883 (destructive and non-destructive)

Chip cutting: MIL STD 883

Column pulling: MIL STD 883

Inverted chip drawing: JEDEC JESD22-B109

Daily Maintenance and Best Practices

To maintain the above accuracy in the long term, it is recommended to establish the following maintenance system:

7.1 Daily Inspection Items

Visually inspect whether the sensor probe is bent or adhered to foreign objects.

Perform an electronic calibration without weights to confirm that the zero drift of the sensor does not exceed ± 0.1% of the full range.

Clean the surface of the workbench and vacuum holes to prevent blockage by solder ball fragments.

7.2 Weekly maintenance

Clean the microscope objective and circular light source with neutral cleaner and non-woven fabric.

Test the repeatability of standard calibration fixtures (such as 1mm steel balls) and record the range of three measurements.

7.3 Quarterly Maintenance

Perform a complete weight calibration and update the sensor compensation coefficient.

Check the condition of the XY guide rail grease, and replace it with a special low volatility grease if it has hardened.

Verify the emergency stop button and safety light curtain function.

7.4 Annual Maintenance

Invite authorized service engineers to conduct a geometric accuracy re inspection of the entire machine, including XY perpendicularity, Z-axis perpendicularity to the workbench plane.

Replace all pneumatic pipeline filters.

Upgrade the device firmware to the latest version and obtain optimized calibration algorithms.