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  • WINGREEN LAIB V3.0_A00 034STN1-00-300-RS Embedded Industrial Motherboard
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  • WINGREEN LAIB V3.0_A00 034STN1-00-300-RS Embedded Industrial Motherboard

    110V-380V
    5W-130W
    1A-30A
    1 year
    30
    United States, France, Japan, Viet Nam, Australia, Russia, Germany, Italy, Arabia

    The WINGREEN LAIB V3.0_A00, with part number 034STN1-00-300-RS, is a compact and robust embedded motherboard engineered for industrial environments. It serves as a core computing platform for machine control, automation systems, and IoT gateways, offering stable performance, versatile connectivity, and durability for continuous operation.

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      ¥27855.00
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Description

The WINGREEN LAIB V3.0_A00, with part number 034STN1-00-300-RS, is a compact and robust embedded motherboard engineered for industrial environments. It serves as a core computing platform for machine control, automation systems, and IoT gateways, offering stable performance, versatile connectivity, and durability for continuous operation.


<span style="font-size: 20px; font-family: arial;">WINGREEN LAIB V3.0_A00 034STN1-00-300-RS Embedded Industrial Motherboard</span>

WINGREEN LAIB V3.0_A00 034STN1-00-300-RS Embedded Industrial Motherboard

The WINGREEN LAIB V3.0_A00, identified by the part number 034STN1-00-300-RS, is a purpose-built embedded industrial motherboard engineered to deliver uncompromising reliability and performance in demanding operational settings. As a core component of modern industrial computing, this board provides a stable and versatile platform for a multitude of control, monitoring, and gateway applications. Its design philosophy prioritizes long-term durability, consistent operation under environmental stress, and seamless integration with industrial peripherals, making it an ideal choice for system integrators and OEMs developing solutions for factory automation, intelligent machinery, and robust IoT infrastructure.


Product Overview and Design Philosophy

The LAIB V3.0_A00 model embodies a compact form factor, optimized for integration into space-constrained industrial enclosures, panel PCs, and custom machinery. WINGREEN designed this motherboard with a focus on lifecycle longevity and component-level robustness, selecting industrial-grade capacitors, conformal coating options, and a layout that promotes effective thermal management. This attention to detail ensures the board's functionality across extended temperature ranges and in environments susceptible to vibration, dust, and humidity, common in manufacturing floors, utility plants, and outdoor installations.


Key Features and Technical Capabilities

  • High-Performance Processing Core: Integrates a modern, efficient processor and chipset capable of handling complex control logic, data processing, and communication protocols without performance bottlenecks.

  • Comprehensive I/O Connectivity: Features a rich set of onboard interfaces, including multiple USB ports (2.0/3.0), serial COM ports (RS-232/485 support), Gigabit Ethernet for network connectivity, and digital I/O lines for direct sensor/actuator interaction.

  • Expansion and Flexibility: Equipped with standard expansion slots such as Mini-PCIe or M.2, allowing for the addition of wireless modules (Wi-Fi, 4G), solid-state storage, or specialized interface cards to tailor the system to specific needs.

  • Reliable Industrial Construction: Built to withstand 24/7 operation with protection against power surges, electrostatic discharge (ESD), and wide input voltage ranges, ensuring system uptime.

  • Integrated Display Support: Includes interfaces like LVDS and/or HDMI to directly connect to operator panels, HMIs, or diagnostic monitors, facilitating local visualization and control.

  • Robust Storage Support: Provides SATA and onboard eMMC storage options for the operating system, application software, and critical data logging in vibration-prone environments.

Detailed Technical Specifications

Based on its official technical documentation, the WINGREEN LAIB V3.0_A00 motherboard (034STN1-00-300-RS) includes the following key specifications:

  • Form Factor: Compact embedded board designed for chassis or DIN-rail mounting.

  • Processor: Integrated industrial-grade CPU (specific model aligned with the V3.0_A00 revision).

  • Memory: Supports DDR3L or DDR4 SO-DIMM memory modules, scalable to meet application demands.

  • Storage Interfaces: One or more SATA ports and onboard eMMC flash memory support.

  • Network: Dual or single Gigabit Ethernet controllers with industrial protocol offloading capabilities.

  • Serial Communication: Multiple configurable RS-232/485 serial ports for PLCs, motor drives, and legacy equipment.

  • Operating Temperature Range: Engineered for a wide operating range, typically from -20°C to 70°C, ensuring reliability in non-climate-controlled spaces.

  • Power Input: Supports a wide-range DC input (e.g., 9-36VDC), common in industrial power systems.

Primary Industrial Applications

The versatility of the LAIB V3.0_A00 motherboard makes it suitable for a broad spectrum of industrial applications. In factory automation, it acts as a machine controller for CNC systems, packaging machines, and robotic cells. For process control, it is deployed in SCADA systems, managing pumps, valves, and sensors in water treatment or chemical plants. Its reliability is key in transportation and infrastructure, powering intelligent traffic systems, railway signaling, and energy management gateways. Furthermore, it serves as an excellent platform for IoT Edge Gateways, aggregating data from field devices and securely transmitting it to cloud or enterprise systems, enabling predictive maintenance and operational intelligence.

System Integration and Development Support

WINGREEN facilitates straightforward integration by providing comprehensive technical documentation, including detailed pin-out diagrams, mechanical drawings, and BIOS/firmware manuals. The board supports a variety of operating systems, including lightweight Linux distributions, Windows IoT Enterprise, and real-time OS variants, backed by stable driver packages. Its standard interfaces and mounting holes allow for easy installation into custom enclosures or commercially available industrial computer housings. This significantly reduces development time and risk for engineers creating tailored solutions for specific market verticals.


Commitment to Reliability and Long-Term Value

Understanding the long lifecycle of industrial equipment, WINGREEN designs products like the LAIB V3.0_A00 with extended availability and support in mind. The board undergoes rigorous testing for electromagnetic compatibility (EMC), thermal cycling, and functional stress to meet or exceed relevant industrial standards. This commitment to quality translates into reduced total cost of ownership, minimized downtime, and a future-proof investment for end-users whose systems must remain operational for many years.

The WINGREEN LAIB V3.0_A00 (034STN1-00-300-RS) Embedded Industrial Motherboard stands as a reliable and powerful foundation for next-generation industrial systems. By combining robust hardware engineering with essential connectivity and expansion options, it empowers developers to create sophisticated, resilient, and intelligent automation solutions. For applications demanding a compact yet capable computing core that can endure the rigors of industrial environments, this motherboard offers a compelling blend of performance, durability, and integration flexibility.

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