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ADLINK MXC-6300 Fanless Embedded Industrial Control Computer Deployment Guide

F: | Au:FANS | DA:2026-07-10 | 319 Br: | 🔊 点击朗读正文 ❚❚ | Share:

ADLINK MXC-6300 Fanless Embedded Industrial Control Computer Deployment and Engineering Practical Guide

Why choose MXC-6300? ——Balance between Fanless and Scalability

In the fields of industrial automation, machine vision, intelligent transportation, and on-site monitoring, industrial control computers need to cope with harsh environments such as high temperature, vibration, and dust, while also having sufficient computing power and scalability. The MXC-6300 series fanless embedded computer launched by ADLINK is equipped with the third-generation Intel Core i7/i5/i3 processor (Ivy Bridge) and QM77 chipset. It integrates PCI and PCIe expansion slots, 16 isolated digital I/O, dual SATA RAID, and three independent displays in a compact fanless chassis, achieving a balance between performance and reliability.

This article is based on the MXC-6300 user manual, providing engineers with a complete on-site implementation guide from hardware disassembly, installation and deployment, isolated I/O wiring, RAID configuration, Watchdog programming to BIOS tuning.


Hardware Architecture Overview - Powerful "Core" Without Fans

2.1 Processor and Chipset

The MXC-6300 series offers three CPU options (all packaged in rPGA and pluggable):

MXC-6301D: Intel Core i7-3610QE (quad core 2.3GHz, 6MB cache, turbo 3.3GHz)

MXC-6302D: Intel Core i5-3610ME (dual core 2.7GHz, 3MB cache, turbo 3.3GHz)

MXC-6303D: Intel Core i3-3120ME (dual core 2.4GHz, 3MB cache)

The chipset is Intel QM77, supporting DDR3 1333/1600 SO-DIMM, with a maximum of 16GB (dual slots). QM77 also offers USB 3.0, SATA 6Gb/s, and Intel AMT 8.0 remote management capabilities.

2.2 Fanless heat dissipation and wide temperature design

The whole machine adopts all aluminum heat dissipation fins and heat pipes for passive heat dissipation, and the CPU and PCH directly contact the heat sink through thermal pads. Working temperature range:

Standard configuration (HDD): 0 ℃~50 ℃

Industrial grade SSD/CFast configuration: -20 ℃~60 ℃ (MXC-6302/6303) or -20 ℃~55 ℃ (MXC-6301)

Key heat dissipation reminder: The manual clearly requires at least 2 inches (5cm) of ventilation space to be reserved at the top of the chassis. If installing a high-power PCI/PCIe expansion card, it is recommended to install an optional fan module (hot swappable, powered through an internal USB interface).

2.3 Dimensions and Installation

The body size is 172.5 (W) × 213 (H) × 225 (D) mm, with a weight of approximately 4.3kg. It comes standard with a wall bracket and can be installed with DIN rails (additional accessories required).


Detailed explanation of key interfaces and connections

3.1 Front panel I/O overview (from left to right)

Number interface description

A power button (with blue LED) is not self-locking, press and hold for 5 seconds to force shutdown

B LED indicator lights WD (yellow, watchdog), HD (orange, storage active), DG (green, diagnostic)

C Reset button hardware reset

D 68 pin VHDCI digital I/O 16 isolated DI+16 isolated DO

E USB 2.0 ×2 Type-A

F USB 3.0 × 4 Type-A, blue

G serial port x 4 DB9, COM1/2 supports RS-232/422/485 (BIOS configurable), COM3/4 only supports RS-232

H DisplayPort × 2 supports DP → VGA/DVI/HDMI adapter (passive/active adapter)

I Audio Interface Green (Line out), Pink (Mic in)

J PS/2 keyboard mouse purple (keyboard), green (mouse)

K DC power input 3-pin plug-in type, 9-32V wide voltage input

PCI/PCIe extension PCI (32-bit 5V)+PCIe x16 or PCI+PCIe x8 × 2 (automatic switching)

3.2 Isolated Digital I/O - "Hardcore" Interface for Industrial Control

MXC-6300 board carries 16 isolated DI and 16 isolated DO, which are led out through a 68 pin VHDCI connector. This is its core feature that distinguishes it from ordinary industrial computers.

3.2.1 DI Characteristics

Input voltage range: 5~24V (logic high), 0~1.5V (logic low)

Input resistance: 8.2k Ω @ 0.75W

Isolation voltage: 1500V DC (optocoupler isolation)

Input method: Differential input (DI0~DI7 are differential pairs, DI8~DI15 are single ended, common ground ISO_com)

Practical wiring operation:

Differential input (DI0~DI7): Each channel has two pins, H (high) and L (low), with external signals connected between H and L. The manual provides a differential input circuit diagram (Figure 1-9), and it is recommended to use shielded twisted pair cables.

Single ended input (DI8~DI15): signal connected to DIn, common terminal connected to ISO_CM.

Application circuit example (manual figure 1-10): NPN sensor output connected to DIn, sensor power supply positive terminal connected to external 24V, negative terminal connected to ISO-COM. The input resistance of 8.2k Ω determines approximately 3mA@24V The input current is sufficient to drive most photoelectric sensors.

3.2.2 DO Characteristics

Output type: MOSFET transistor (similar to open collector)

Driving capability: continuous 100mA/channel, peak 250mA/channel

Power supply voltage: 5-35V DC (externally provided)

Important protection: The VDD pin is connected in series with a Flywheel diode to suppress the back electromotive force when inductive loads (relays, solenoid valves) are turned off. VDD must be connected to the positive pole of an external power source to form a freewheeling circuit.

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