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ADLINK AmITX-SL-G Mini ITX Motherboard Deployment and SEMA Guide

F: | Au:FANS | DA:2026-07-21 | 379 Br: | 🔊 点击朗读正文 ❚❚ | Share:

ADLINK AmITX-SL-G Mini ITX Industrial Motherboard Deployment and SEMA Management Guide

In the fields of industrial automation, machine vision, edge computing and digital signage, the Mini ITX plate type, with its compact size of 170mm × 170mm, flexible expansion capability and standardized installation hole location, is an ideal choice for space constrained high-performance applications. The AmITX-SL-G launched by ADLINK is a desktop level 6/7 generation Intel based product ®  Core ™  I7/i5/i3 and Pentium ®/ Celeron ®  Mini ITX embedded motherboard with Intel processor ®  Q170 or H110 chipset, supporting LGA1151 slot CPU, up to 64GB DDR4 memory, and providing three independent DisplayPort display outputs, dual Gigabit Ethernet (supporting Intel) ®  AMT/vPro, USB 3.0/2.0, SATA 6Gb/s, PCIe x16 expansion and other rich I/O. The board is equipped with ADLINK's unique SEMA (Smart Embedded Management Agent) onboard management controller, which enables hardware monitoring, watchdog, dual BIOS fault recovery, intelligent fan speed regulation, and remote management. This article will provide a detailed deployment and debugging reference for system integration engineers from the aspects of hardware architecture, interface definition, jumper configuration, installation points, SEMA functions, BIOS tuning, and system resource allocation.


Product positioning and technical specifications overview

AmITX-SL-G follows the Mini ITX specification (170mm × 170mm), is compatible with Micro ATX and standard ATX chassis, and is powered by a standard ATX power supply (12V ± 5% and 5VSb ± 5%). The board offers two chipset versions:

Q170 version: Supports Intel ®  vPro ™、 AMT 11.0, 3 x DisplayPort, USB 3.0 internal pin layout and richer management functions.

H110 version: Supports 2 x DisplayPort and USB 2.0 internal pin placement for more economical positioning.

The processor is compatible with 6th generation (Skylake) and 7th generation (Kaby Lake) Core/Pentium/Celeron desktop CPUs, including standard 65W and low-power 35W (TE suffix) models, with TDP coverage ranging from 35W to 65W, and requires corresponding heat dissipation solutions. Chipset paired with Intel ®  HD Graphics 530/630 integrated graphics card, supports DirectX 12, OpenGL 4.4, and up to three screens with 4K independent display.

Core specifications:

Memory: 2 x DDR4 SO-DIMM slots, supporting 2133/2400 MHz non ECC memory, maximum 64GB.

Display: Q170 version 3 x DisplayPort 1.2 (up to 4096 x) 2160@24Hz ); H110 version 2 x DP; optional eDP or LVDS (via daughter card), LVDS supports single/dual channel 24 bit up to 1920 x 1080@60Hz .

Network: Dual Intel ®  Ethernet - i219-LM (Q170 supports AMT)/i219-V (H110)+i211AT (MAC/PHY), supports both PCIe and WoL.

Storage: 3 x SATA 6Gb/s (SATA1/2 can optionally provide 3.3V/5V DOM power through pin 7).

Expansion: 1 x PCIe x16 (Gen3), 1 x PCIe x1 (Gen2), 1 x Half height Mini PCIe (PCIe/USB 2.0), 1 x Full height Mini PCIe (optional mSATA/PCIe/USB 2.0).

I/O interface: rear 4 x USB 3.0+4 x USB 2.0; Onboard 2 x USB 3.0 pin (Q170) or 2 x USB 2.0 pin (H110); 4 × COM (SER1 supports RS-232/422/485 with power supply selection, SER2-4 only supports RS-232); PS/2 KB/MS; 7.1 channel HD Audio (ALC886).

Security features: optional TPM 1.2 (Atmel) or TPM 2.0 (Infineon SLB9665, A3 hardware version only); BIOS write protection.

SEMA management: voltage/current monitoring, watchdog, dual BIOS fault recovery, intelligent fan, runtime statistics, abnormal code diagnosis, etc.

This board supports Windows 7/8.1/10 (64 bit) and mainstream Linux distributions.


Detailed explanation of board layout and connectors

1. Rear I/O

DisplayPort (3 Q170 versions, 2 H110 versions): DP 1.2, highest 4K@24Hz .

Dual Gigabit Ethernet ports (LAN1/LAN2): RJ-45, built-in Link/Activity (orange/green) and Speed (green/orange) LEDs.

USB 3.0 (4 blue Type-A) and USB 2.0 (4 black Type-A): A total of 8 rear USB ports, powered by 5V, supporting S3/S4 wake-up.

Audio interface: 5 3.5mm sockets (7.1 channels)+S/PDIF output (RCA coaxial).

2. Onboard internal connectors (Component Side)

CPU socket: LGA1151, supports 6/7 generation Core processors.

SODIMM slots: Two, angled plug-in.

SATA (SATA1/2/3): 7P L-type, supporting 6Gb/s. SATA1/2 can provide DOM power (NA/3.3V/5V) through jumper selection pin 7.

SATA power supply (ST-PWR1/2): 5-pin power supply interface (12V/5V/3.3V).

PCIe Expansion: 1 x PCIe x16 (Gen3), 1 x PCIe x1 (Gen2), 1 x Half Height Mini PCIe e, 1 x Full Height Mini PCIe e (switchable to mSATA via jumper).

USB Pin: Q170 version 2 x USB 3.0 (19 pin); H110 version 2 x USB 2.0 (2 x 5-pin).

Serial ports: SER1~SER4 (2 × 5-pin, 2.0mm pitch). SER1 supports RS-232/422/485 mode switching and power supply (NC/5V/12V); SER2-4 only uses RS-232.

PS/2: 6-pin pin arrangement (requires optional Y-wire).

Audio pin: 2 × 13 pin, sharing signal with rear audio.

LVDS interface (optional): 30 pin FFC (1mm pitch), supports single/dual channel 24 bit, maximum 1920 × 1080@60Hz (via eDP to LVDS converter).

LVDS auxiliary interface: backlight control (PWM), backlight enable, backlight power supply (5V/12V optional).

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