In the fields of industrial automation, machine vision, and motion control, devices not only require powerful computing power, but also must be compatible with a large number of still in service PCI traditional expansion cards, while supporting the new generation of PCIe high-speed acquisition cards. How to provide flexible expansion slots under fanless heat dissipation constraints and ensure long-term stable operation of the system in harsh environments is a practical challenge faced by many system integrators.
The MVP-6100 series launched by ADLINK is a fanless embedded computer aimed at the value market. It inherits the rugged genes of the MXC/MXE series and provides PCIe x16 and PCI hybrid expansion capabilities (2 or 4 slots backplane optional), equipped with 9th generation Intel ® Core ™/ Xeon ®/ Celeron ® Processor, supporting DDR4 ECC memory, three-way independent display, and wide voltage DC input. This article will provide engineers with a comprehensive technical reference from the dimensions of model configuration, hardware architecture, I/O layout, expansion backplane, installation specifications, BIOS deep tuning, and watchdog/DIO development libraries.
Product series and model matrix
The MVP-6100 series is divided into multiple sub models based on the number of processors, chipsets, and expansion slots. The main classifications are as follows:
MVP-612X/614X: Equipped with Intel ® Xeon ® Processor (80W), C246 chipset, supports ECC memory vPro/AMT、 Three displays RAID。
MVP-612A/614A: Equipped with Intel ® Core ™ I7 (65W), H310 chipset, does not support ECC, dual display.
MVP-6121 / 6141:Core ™ I7 35W, H310 (6121) or C246 (6141).
MVP-6122 / 6142:Core ™ I5 35W, H310 or C246.
MVP-6123 / 6143:Core ™ I3 35W, H310 or C246.
MVP-6124 / 6144:Celeron ® 35W, H310 or C246.
The 612X series offers a 2-slot backplane (1 x PCIe x16+1 x PCI), while the 614X series offers a 4-slot backplane (1 x PCIe x16+2 x PCIe x4+1 x PCI). The two series have different external dimensions: 612X with a width of 165mm, 614X with a width of 206mm, and both have a depth and height of 240mm × 210mm.
Core processor and memory support
The entire series adopts LGA1151 socket, compatible with 9th generation Intel ® Core ™ Coffee Lake Refresh and Xeon ® E-series processors. Optional Intel chipset ® H310 or C246, the latter supports ECC memory, Intel AMT/vPro, RAID 0/1/5/10, and more PCIe channels.
In terms of memory, 2 x DDR4 SO-DIMM slots are provided, supporting a maximum of 32GB DDR4 2400MHz. For models with Xeon or specific Core i3/Celeron paired with C246 chipset, ECC memory can be selected to meet control applications that require extremely high data integrity.
Integrated with Intel ® HD Graphics 630 core display, supports H.265/HEVC hardware decoding, and enhances video stream processing capabilities.
External I/O interfaces: three displays, three networks, multiple serial ports
MVP-6100 arranges all external interfaces on the front panel (see Figure 3-1), with a single-sided maintenance design that facilitates on-site wiring.
1. Display output
Provide 2 x DisplayPort++, 1 x DVI-D, and 1 x VGA, supporting up to three independent displays (C246 chipset) or two (H310). Highest resolution:
DP1/DP2:4096× 2304@60Hz
DVI-D:1920× 1200@60Hz
VGA:1920× 1080@60Hz
The rich display interface can simultaneously connect to the operation screen, debugging screen, and monitoring screen.
2. Network communication
Onboard 3 x Intel GbE (2 x i211AT+1 x i219), supporting link aggregation (Teaming), IEEE 1588 time synchronization, PCIe remote boot, and WOL (Wake on LAN). The C246 model i219 supports Intel AMT for easy remote management.
3. USB and serial port
USB: H310 model provides 3 x USB 3.1 Gen1+3 x USB 2.0; The C246 model offers 2 x USB 3.1 Gen2+1 x USB 3.1 Gen2+3 x USB 2.0. There is also 1 x USB 2.0 Type-A used internally for encryption dongles.
Serial port: 4 × DB9 COM ports, with COM1/2 supporting RS-232/422/485 (BIOS switching) and COM3/4 fixed RS-232. Optional COM5/6 (pin arrangement, shared with DI/O).
4. Digital I/O and Audio
8 × DI+8 × DO (non isolated): The electrical specifications are consistent with MVP-5100 (input high 2~5.25V, low 0~0.8V; output open drain MOSFET, 24mA drive).
Audio: Line out and Mic in (configurable as Speaker out).
5. CFast and Storage
The front panel provides a CFast Type II slot (SATA 3.0, 3Gb/s) for quick replacement of system disks. Internally supports 2 x SATA 6Gb/s (2.5 "hard drive/SSD), C246 model can be expanded to 4 SATA and supports RAID.
Expansion Backplane: PCIe x16 coexists with PCI
The core differentiation design of the MVP-6100 series lies in its backplane expansion capability, which is available in two versions: 2-slot and 4-slot.
2-slot backplate (MVP-612X series)
1 x PCIe x16 Gen3 slot: supports standard full height PCIe cards, with signals directly connected to the CPU.
1 x PCI slot: Based on ITE IT8892E PCIe to PCI bridge, connected to the host through PCIe x1 Gen3 interface, supporting universal or 5V 32-bit PCI card (33MHz). This design allows old motion control cards or data acquisition cards to continue serving on new platforms.