ADLINK MXE-230 series Alder Lake platform industrial computer deployment and maintenance manual

ADLINK MXE-230 series Alder Lake platform industrial computer deployment and maintenance manual

Introduction: A New Generation Compact Industrial Control Platform for Intelligent Edge

With the acceleration of integration of industrial IoT and AI edge computing, field controllers need to integrate stronger computing power, faster storage interfaces and richer I/O scalability in limited space. The ADLINK Matrix series MXE-230 is an ultra compact ruggedized edge computer designed based on this requirement. This platform is equipped with Intel Alder Lake-N series or Amston Lake series processors (with the highest quad core E-core architecture), supporting DDR5 4800MHz memory, three-way M.2 expansion (B/E/M-Key), dual gigabit industrial Ethernet (i210IT), and dual three in one switchable serial ports. It also provides optional 2.5KV isolated digital I/O (8DI/8DO), suitable for harsh scenarios such as smart factories, traffic monitoring, and new energy management.

Analysis of hardware architecture and SKU differences

1.1 Processor and Memory

CPU: Intel Alder Lake-N series (such as N97, quad core 3.6GHz) or Amston Lake series, using Gracemont energy-efficient core architecture, with a TDP of approximately 12W.

Memory: Single DDR5 SO-DIMM slot, up to 16GB @ 4800MHz. Compared to DDR4, the bandwidth has increased by about 50%, resulting in significant gains for data caching and AI inference tasks.

1.2 SKU configuration differences (key)

MXE-230 offers multiple SKUs to adapt to different application scenarios, mainly reflected in height and I/O configuration:

SKU height serial port digital I/O network port

MXE-231 (basic type) 62mm 2 × RS-232/422/485 without 2 × GbE

MXE-231/4LAN 75mm 2 × RS-232/422/485 without 4 × GbE

MXE-231/4COM 75mm 4 × RS-232/422/485 (with 2 isolated channels) 8DI/8DO (2.5KV) 2 × GbE

MXE-231/6COM 75mm 6 × RS-232/422/485 (including 2 isolated channels, 2 standard channels) 8DI/8DO (2.5KV) 2 × GbE

Engineering reminder: When selecting, the SKU should be determined based on the required number of serial ports on site and whether DIO isolation is needed. If more than 4 serial ports or isolated I/O are required, the 75mm height version must be selected.

1.3 Storage and Expansion

M. 2 M-Key (2280): Supports NVMe SSD, PCIe Gen3 × 2 speed (approximately 16Gbps), used for high-speed system disks.

M. 2 E-Key (2230): Supports Wi Fi/Bluetooth module (PCIe+USB) for wireless connection.

M. 2 B-Key (3042): Supports 4G/LTE modules (only USB 3.0+USB 2.0, no PCIe), and works with external antennas to achieve cellular communication.

SATA port: Additional 1 SATA III (6Gbps) and SATA power cable are provided, which can install 2.5-inch SSD/HDD.

Practical operation of mechanical installation and expansion module

2.1 Dimensions and Installation Method

Basic dimensions: 165 (W) × 120 (D) × 62 (H) mm (standard type); 75mm high version is used for 4LAN/4COM/6COM SKUs.

Wall mounted installation: Comes with two wall brackets, fixed with M4 screws. Safety constraint - As the antenna interface is located on the front panel, it is necessary to ensure that the front and rear panels are on both sides when wall mounted. It is strictly prohibited to face the wall from the top or bottom to avoid affecting the radiation efficiency of the antenna.

DIN rail installation: Optional rail bracket, suitable for standard 35mm DIN rail installation.

2.2 Installation steps of M.2 module (key operations)

Dismantling the top cover: Unscrew the top 4 screws and the rear 2 screws.

Remove the heat sink: Unscrew the 2 fixing screws on the M.2 heat sink, carefully remove the heat sink, and be careful not to damage the thermal pad (if the pad is damaged, it needs to be replaced to ensure thermal conductivity).

Installation module: Insert the M.2 module into the corresponding slot at an angle of about 30 ° (pay attention to the foolproof notch), and press it down to the horizontal.

Restore the heat sink: Cover the heat sink on the module and tighten the screws. Improper installation may lead to module overheating, speed reduction, or even damage.

Sealed top cover: Replace all screws to ensure grounding continuity.

Important reminder: B-Key module only supports USB signal, do not insert PCIe/NVMe module; M-Key only supports NVMe and does not support SATA protocol.

2.3 SATA SSD Integration

Reserved SATA data cable and power cable (SATA Power Wafer) inside the device for connecting 2.5-inch SSDs. The SSD needs to be fixed in a reserved position inside the chassis (usually using bottom screw holes).

Power Design and Power Management

3.1 Power Input

Interface: DC Jack (positive inside and negative outside) or pluggable terminal (specific configuration needs to be confirmed).

Input voltage: 12V~24V DC (typical industrial 24V).

Minimum power supply: It is recommended to be no less than 40W, considering high temperature derating (such as leaving a 20% margin for power output in a 60 ° C environment).

3.2 Reference for power consumption measurement (12V power supply)

Power consumption under working conditions

Shutdown (S5) 3.9W

System idle 12.3W

Processor fully loaded 30.1W

System full load (CPU+IO) 30.3W

Thermal management: The main heating elements (CPU, PCH) are located on the left side, in contact with the heat sink and aluminum casing through a thermal pad. Be sure to leave at least 5cm clearance below the device to ensure natural convection. Working temperature range -20 ° C~60 ° C (storage -40 ° C~85 ° C); If using an AC adapter (non DC direct supply), the upper limit is reduced to 50 ° C.