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ADLINK MXE-210 Compact Fanless Industrial Control Computer Hardware Deployment and Debugging Guide

F: | Au:FANS | DA:2026-08-17 | 4 Br: | 🔊 点击朗读正文 ❚❚ | Share:

ADLINK MXE-210 Compact Fanless Industrial Control Computer Hardware Deployment and Debugging Guide

Introduction: Design Philosophy of Compact Reinforced Edge Control Platform

In the fields of intelligent transportation, facility management, and industrial automation, edge controllers are often deployed in cabinets or mobile carriers with limited space, unstable power supply, and severe vibration. The ADLINK Matrix series MXE-210 is a compact fanless embedded computer tailored for such scenarios. Based on Intel ®  The Atom x7-E3950 or x5-E3930 processor (formerly Apollo Lake-I platform), with an ultra small size of 140 × 110 × 58mm, offers dual GbE, dual switchable serial ports (RS-232/422/485), dual USB 3.0, and dual Mini PCIe expansion slots, and supports ultra wide temperature operation from -40 ° C to 85 ° C (specific models). More noteworthy is that it integrates rich wafer interfaces such as I2C, HSUART, GPIO, etc. internally, providing great customization flexibility for system integrators.


Hardware architecture and core features

1.1 Processor Platform

MXE-210 offers two SKUs:

MXE-211: Equipped with Atom x7-E3950 (quad core 1.6GHz, burst 2.0GHz, 12W TDP), it is suitable for medium load edge computing and protocol conversion.

MXE-212: Equipped with Atom x5-E3930 (dual core 1.8GHz, burst 1.8GHz, 6.5W TDP), suitable for low-power, single task scenarios.

Both are integrated with Intel Gen9 graphics engine and support DP1.2 output (up to 4096 × 4096) 2160@60Hz )Can be connected to a 4K monitor for local monitoring. The memory adopts a single DDR3L 1600MHz SO-DIMM, with standard configuration of 2GB and maximum support of 8GB.

1.2 Storage Expansion Options

Onboard mSATA full-size slot: used for installing system SSDs, supporting SATA III protocol.

Optional 2.5-inch SATA SSD: Connected through an internal SATA wafer (CN32), requiring an additional mounting bracket.

MicroSD card slot (CN31): Supports up to 32GB of expandable storage and can be used for system backup or data logging.

1.3 Wireless and cellular expansion

The device provides two full-size Mini PCIe slots:

Slot 1 (CN14): Supports mSATA SSD or WiFi/Bluetooth module (USB+PCIe signal).

Slot 2 (CN16): Comes with a matching USIM card slot (CN15), specifically designed for 3G/4G LTE modules, and supports telecom operator authentication.

Engineer reminder: The electrical definitions of the two slots are different - Slot 1 focuses on storage (SATA signal), while Slot 2 focuses on communication (USB+PCIe+SIM). Before installation, it is necessary to confirm that the module type matches the slot.

1.4 Internal Expansion Interface (Key Features)

The MXE-210 motherboard provides a variety of wafer connectors for customized expansion:

HSUART (CN22): 1 high-speed UART (including RTS/CTS flow control), used to connect serial peripherals.

I2C × 2 (CN18, CN20): Different I2C buses are respectively introduced, which can be used to mount sensors, EEPROM, or IO expansion chips.

USB 2.0 (CN19): Internal USB Host interface, capable of connecting encryption dongles or dedicated modules.

GPIO/Interrupt (CN27): Extended reset signal.

GPS antenna power supply (CN12): Provides+5V output for active GPS antenna.

RTC Battery (CN_SAT): Standard 3V button battery holder, used for system clock maintenance.

These interfaces make the MXE-210 far superior to ordinary industrial computers and can evolve into specialized controllers for specific industries.


Practical operation of mechanical installation and expansion module

2.1 Dimensions and Installation Method

Size: 140 (W) × 110 (D) × 58 (H) mm, weight approximately 0.95kg.

DIN rail installation: Standard rail bracket, fixed to the back of the equipment with 2 M4 screws (hole spacing detailed in the manual mechanical diagram), suitable for standard 35mm DIN rails.

Wall mounted installation: Optional wall mounted kit, pay attention to safety constraints - as the antenna interface is located on the front panel, it is necessary to keep the front and rear panels on both sides when wall mounted. It is strictly prohibited to face the top or bottom of the device towards the wall to avoid affecting antenna radiation and heat dissipation airflow.

2.2 Disassembly of Bottom Cover and Internal Access

All internal module installations must first remove the bottom cover:

Unscrew the 9 screws at the bottom (note that there may be differences in length, mark them properly).

Be careful to separate the bottom cover and be careful not to break the internal wiring (especially the antenna feeder).

2.3 mSATA SSD installation

Insert the mSATA module into Slot 1 (CN14) at an angle of approximately 30 °, aligning with the golden finger.

Press down to level and secure with the two M2.5 × L5 screws included.

Attention: mSATA and Mini PCIe have the same physical interface but different electrical components. Do not insert the WiFi module into the mSATA dedicated slot.

2.4 Installation of 3G/4G LTE module and SIM card

First, remove the remaining two screws from the right panel and remove the side panel.

Insert the Nano/Micro SIM card (to be provided by the user) into the USIM card slot (CN15), ensuring that the metal contacts are facing downwards and aligned with the missing corner direction.

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