Mercury Step C-663 Stepper Motor Controller

The Mercury Step C-663 is a compact, high-resolution 1-axis stepper motor controller from Physik Instrumente (PI), a global leader in precision motion control systems. Designed for 2-phase stepper motors, this controller offers both open-loop and closed-loop operation modes, achieving an exceptional microstep resolution of 1/2048 of a full step. It is ideal for applications requiring smooth motion, high positioning accuracy, and minimal vibration, such as optical alignment, semiconductor manufacturing, and precision automation.

High Microstep Resolution and Motion Smoothness

The C-663's 1/2048 microstep resolution significantly reduces step angle, resulting in ultra-smooth motion with minimal vibration and audible noise. This high resolution is particularly beneficial for applications requiring fine positioning and low-speed operation. The controller supports both open-loop operation for cost-effective applications and closed-loop operation with encoder feedback for high-accuracy positioning. The built-in PID controller optimizes motion performance, and parameters can be changed during operation for dynamic adjustment.

Extensive Connectivity and Software Support

The C-663 offers flexible connectivity through USB and RS-232 interfaces, with differential encoder inputs for precise position feedback. TTL inputs accommodate limit and reference point switches, while an RS-422 input supports index switch connections. The controller is networkable via daisy chain, allowing up to 16 units to be combined for multi-axis motion systems. Comprehensive software support includes drivers for LabVIEW, dynamic libraries for Windows and Linux, and support for C, C++, MATLAB, and Python, enabling seamless integration into custom applications. The PIMikroMove user software provides an intuitive interface for configuration and motion control.

Application Domains

The Mercury Step C-663 is used in photonics and optical alignment (laser beam steering, fiber positioning), semiconductor manufacturing (wafer inspection, die bonding), precision automation (pick-and-place, micro-assembly), test and measurement equipment, and laboratory automation for sample positioning and scanning stages.