Length (B): 6-12 in (152-305 mm)
Outer diameter (C): 3-4 inches (76-102 mm) larger than the inner diameter
Power and weight:
Power range: 175-850 W
Weight: 0.14-0.71 lbs (0.06-0.32 kg), suitable for small tube heating
4. Customized molded heater
Adaptation scenarios: Multi sided integrated box (up to five sides), complex curves, polygons, curved arrays, and other non-standard structures.
Size restrictions:
Maximum tablet size: 34 × 52 in (860 × 1320 mm), thickness>4 in (102 mm)
Maximum semi cylindrical inner diameter: 24 in (610 mm)
Exceeding 180 ° surface: using multi arc splicing or flat array scheme
(3) Key feature options and enhanced configurations
1. Surface treatment and emissivity optimization
High emissivity coating: Black coating (part number CFBSC), emissivity close to 1.0, improves radiation heat transfer efficiency, and is suitable for scenarios that require rapid heating.
Hardening treatment: Rigid hardening agent (CFRGDPT/CFRGDGAL), used to repair cutting edges or enhance surface hardness to avoid handling damage.
2. Thermocouple installation plan
Embedded ceramic tube: available in two inner diameters of 0.140 in (3.6 mm) and 0.265 in (6.7 mm), with a length of 0.9-1.9 in, used for fixing thermocouples and achieving electrical isolation.
Component installation tube: Horizontal BTE closed end tube (part number CC405 series), installed between heating elements to accurately monitor element temperature and achieve over temperature protection.
3. Lead configuration and protection
Lead type:
Ribbon lead: Made of 601 alloy 600 material, with three output directions of A/B/C, default length of 12 inches, customizable from 0 to 42 inches.
Flexible lead: nickel material MGT insulation, Chromel ®- A/nickel alloy material, suitable for complex wiring scenarios.
Protective accessories: Ceramic sleeve (CC405 series), ceramic sleeve (CS45 series), used for high temperature protection when leads pass through metal walls.

Performance data and application adaptation
(1) Interpretation of Core Performance Curve
1. Temperature power density relationship
The product performance curve specifies the "safe working area": the intersection point of operating temperature and power density should be located on the left side of the curve, and the closer it is to the curve, the shorter the lifespan. Exceeding the curve may result in component burnout. Key conclusion:
At 2200 ° F (1204 ° C), the maximum safe power density is approximately 10 W/in ² (1.55 W/cm ²).
At 1800 ° F (982 ° C), high-power density models (V-shaped sine elements) can achieve 17-20 W/in ² (2.6-3.1 W/cm ²).
Below 1500 ° F (815 ° C), the power density can be increased to 25-30 W/in ² (3.9-4.6 W/cm ²).
2. Heating/cooling and power demand
Small fully cylindrical furnace (inner diameter 3/4-1 3/4 in):
Heating rate: It takes 10-20 minutes to rise from room temperature to 2000 ° F (1093 ° C).
Insulation power: Only 30-50% of rated power is required at 2000 ° F.
Medium sized sealed chamber (12 × 12 × 12 in):
Heating rate: It takes 20-30 minutes to rise from room temperature to 2000 ° F.
The temperature of the component is 100-200 ° F higher than the chamber temperature, and precise temperature control is required through thermocouples.
3. Insulation effect and external temperature
After being paired with a 6 lb/ft ³ (96 kg/m ³) ceramic fiber insulation blanket, the external surface temperature significantly decreases:
When the chamber temperature is 2200 ° F (1204 ° C), the external temperature of the 6-inch total wall thickness is ≤ 450 ° F (232 ° C).
When the chamber temperature is 1600 ° F (871 ° C), the external temperature of the 4-inch total wall thickness is ≤ 300 ° F (149 ° C).
(2) Typical application scenarios and adaptation solutions
Industry specific scene recommendation, product form, core configuration, key points, and value reflection
Metal processing melting furnace, insulation furnace, metal transmission line semi cylindrical/customized arc-shaped array - embedded V-shaped sine element
-High emissivity coating
-Thickened wall thickness (4-6 in), good heat resistance and insulation, reduces heat loss, suitable for metal high-temperature treatment
Semiconductor wafer CVD equipment, plasma processing furnace flat type 8/customized multi-faceted integrated embedded coil components
-Low power density (5-10 W/in ²)
-Clean and pollution-free, with strong thermal stability to avoid affecting process accuracy, suitable for vacuum/inert environments
Glass ceramic glass forming furnace, ceramic sintering furnace, fully cylindrical/flat plate splicing - exposed V-shaped sine element
-High power density (15-20 W/in ²)
-Multiple synchronous control systems ensure fast and uniform heating, high radiation efficiency, and improved consistency in product molding
Laboratory R&D small experimental furnace, analytical instrument full cylindrical/small flat plate embedded coil component
-Customized small size (inner diameter<2 inches)
-Quick start stop adaptation, compact size, fast heating and cooling, suitable for frequent testing needs
Chemical/Energy Reactor Heating, Catalyst Activation Custom Box/Arc - Full Edge Insulation Type 8
Email:wang@kongjiangauto.com