ADLINK MVP-3100 and MVP-3120 Embedded Systems

ADLINK MVP-3100 and MVP-3120 Fanless Embedded Systems: A High Performance Computing Platform for Rigorous Industrial Automation and Edge AI

In the fields of industrial automation (IA), machine vision, motion control, and intelligent monitoring, the stability, scalability, and lifecycle management of computing platforms in harsh environments are the core concerns of system integrators and end users. How to achieve high-performance computing under the constraint of passive heat dissipation without fans, while supporting PCIe and PCI traditional device expansion, is a difficult point in the design of new generation embedded systems.

The MVP-3100 series (including MVP-3100 and MVP-3120 models) launched by ADLINK is a value based fanless embedded computer designed to address the aforementioned pain points. This series is based on the 12th/13th/14th generation Intel ®  Core ™  The processor and H610E chipset provide powerful computing power, rich I/O interfaces, and flexible expansion options in a compact mechanical structure.

System Core Architecture and Processor Platform

The core computing unit of MVP-3100 series is equipped with 12th/13th/14th generation Intel ®  Core ™  I3/i5/i7/i9 processors, supporting up to 65W TDP, paired with Intel ®  H610E chipset. Compared to its predecessor, this platform brings significant improvements in IPC (Instructions Per Clock Cycle) and integrates Intel ®  UHD Graphics 770 provides powerful graphics processing capabilities for visual inspection and HMI display.

In terms of memory, the system is equipped with 2x DDR5 SO-DIMM slots, supporting up to 64GB DDR5 4800MHz memory. The high bandwidth characteristics of DDR5 are crucial for applications that require processing large amounts of sensor data or high-resolution image streams.

In addition, the system board is equipped with TPM 2.0 security chip, which meets the compliance requirements of industrial equipment for data encryption and secure boot, ensuring the credibility of the system in critical infrastructure.

Compatibility between storage and operating system

There are differences between MVP-3100 and MVP-3120 in terms of storage expansion:

MVP-3100: Provides 2x SATA interfaces and supports installation of 2.5-inch hard drives/solid-state drives.

MVP-3120: Provides 4x SATA interfaces, making it more suitable for edge storage scenarios that require large capacity local data caching.

Both models support M.2 M Key 2280 (PCIe Gen3x2) and M.2 A+E Key 2230 (PCIe Gen3x1). The former can be used for high-speed NVMe SSDs, while the latter supports Wi Fi/Bluetooth module expansion to meet wireless communication needs.

The operating system supports coverage of Windows 10/11 IoT and Ubuntu 22.04, facilitating rapid migration and deployment of industrial software ecosystems.

Rich I/O interface configuration

As an industrial field oriented device, the front and rear panels of the MVP-3100 series provide a comprehensive combination of I/O interfaces, as shown in Figure 4 (refer to manual Figure 4: External I/O connector locations).

1. Network communication

The MVP-3100 series is equipped with four independent Ethernet ports to meet the requirements of industrial network redundancy or multi segment isolation:

1x 2.5GbE (based on Intel I226-V), used for high-speed data transmission or image streaming.

2x 1.0GbE (based on Intel I210-IT), supporting Time Sensitive Network (TSN) features, suitable for motion control.

1x 1.0GbE (based on Intel I219-V), used for regular network management.

Each road network entrance is equipped with Link/Active and Speed LED indicator lights for easy on-site inspection of physical connection status.

2. USB interface

Provide 8 USB ports:

4x USB 3.2 Gen1 Type-A（5Gbps）， Suitable for high-resolution industrial cameras or high-speed peripherals.

4x USB 2.0 Type-A（480Mbps）， Suitable for keyboards, mice, or low-speed sensors.

3. Display output

Equipped with dual independent display interfaces:

1x HDMI 1.4b， Supports 1080p/60Hz output.

1x DisplayPort 1.4， Supports higher resolution display connections and is compatible with VGA, DVI, and HDMI devices through adapter cables.

4. Serial communication

Provide 3 COM ports:

COM1&COM2: Supports RS-232/422/485 mode switching (set through BIOS) to adapt to fieldbus devices of different protocols.

COM3: Fixed in RS-232 mode, suitable for routine debugging and control.

5. Digital I/O and Audio

8x DI+8x DO: Non isolated digital input/output (TTL level), can be used for simple status indication or alarm signal triggering. The input high-level range is 2V to 5.25V, and the low-level range is 0 to 0.8V; the output is driven by an open drain MOSFET, with a built-in 200 Ω pull-up resistor and a maximum current of 24mA per channel.

Audio interface: Provides Line out and Mic in dual 3.5mm sockets, based on TEMPO 92HD91 audio codec.

6. Antenna and power supply

2x SMA antenna holes for external Wi Fi antennas (2.4GHz/5GHz).

DC power input: Adopting 12-24V wide voltage input (MVP-3100) or 24V input (MVP-3120), and equipped with anti drop power connector.

Mechanical dimensions and fanless heat dissipation design

The MVP-3100 series continues the robust design concept of the ADLINK Matrix product line, adopting a passive cooling solution with an all aluminum casing.