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KEBA KeConnect I/O: Modular Industrial Automation I/O System

F: | Au:FAN | DA:2026-02-12 | 375 Br: | 🔊 点击朗读正文 ❚❚ | Share:

KEBA KeConnect I/O: Modular Industrial Automation I/O System

In the process of industrial automation evolving towards distributed, high real-time, and intelligent systems, I/O systems serve as a bridge connecting controllers and field devices. Their density, accuracy, response speed, and diagnostic capabilities directly determine the overall performance of machine equipment. As an innovative leader in the global industrial control field, KEBA's KeConnect I/O module series provides highly competitive I/O solutions for plastic machinery, packaging equipment, metal forming, and general automation fields with a unified K-bus backplane architecture, diverse module types, rigorous industrial grade design, and seamless integration capabilities with KEBA's full range of controllers. This article is based on the "KeConnect I/O Module Catalog" and provides a systematic technical analysis of the series from three dimensions: product matrix, technical features, and application scenarios.


KeConnect I/O System Architecture: Modular, Scalable, Fully Compatible

The KeConnect I/O system adopts a modular design with unified mechanical and electrical interfaces. All I/O modules have a standard front panel width of 22.5mm (including K-bus plug total width of 32.5mm), a height of 120mm, and a depth of 100mm, supporting toolless DIN rail installation. The module sets the K-bus address through a 16 bit rotary encoder switch on the side, and achieves electrical and data coupling with the CPU module or bus coupler through the back bus connector.

Core compatibility features:

Direct connection CPU: can be directly plugged into the right side of KEBA KeControl C2/C1 series CPU modules to form a compact centralized I/O station;

Remote expansion: Build distributed I/O islands through BL series bus couplers (CANopen or EtherCAT), with a maximum communication distance of 1000 meters (current loop) or 100 meters (EtherCAT);

Hybrid topology: supports the mixed use of I/O modules of different ages and functions on the same bus, fully protecting users' existing investments.


Digital I/O module: high-density, strong drive, fast shutdown

1. DI 240/B and DI 260/A digital input modules

Channel density: 8 channels (DI 240/B) or 16 channels (DI 260/A) Type 1 digital inputs, compliant with EN 61131-2 standard;

Electrical isolation: 707V DC optocoupler isolation, complete isolation between channel and bus;

Interruption capability: The first two inputs (DI0/DI1) support K-bus interrupts with a response time of 100 μ s (combined with 5kHz input filtering), suitable for high-speed event capture;

Adjustable filtering: The global debounce time can be configured as 1ms or 100ms, balancing anti-interference and fast response;

Power consumption: 24V bus power consumption is only 1W, 5V bus power consumption is 0.4W, extremely low heating.

2. DO 242/B and DO 272/A digital output modules

Channel and current: 8/14 semiconductor outputs, single channel rated current 2A, group synchronization rate 50%;

Quick shutdown: optimized for inductive loads (hydraulic valves, contactors), built-in freewheeling diode, maximum shutdown capability 1J@0.2Hz Inductive energy significantly reduces shutdown delay;

Protection and diagnosis: permanent short circuit protection, independent short circuit detection and reporting for each channel;

Power supply method: The load power supply is independently connected from the front end of the module and isolated from the bus power supply. The maximum power consumption of a single module is 2.1W (24V).

3. DM 27x/A digital hybrid module

Flexible wiring: DM 272/A provides 8 drain type inputs and 8 source type outputs; DM 276/A provides 6 source inputs and 8 drain outputs, perfectly adapting to different wiring habits in Asia/Europe;

Interrupt input: Two inputs can be configured as interrupt sources, with a response time of 50 μ s, which is twice as long as a pure input module;

Output characteristics: 2A/50% simultaneous rate, inter group electrical isolation (707V DC), supporting independent channel short-circuit shutdown;

Integration: Single module achieves 16 point hybrid I/O, saving control cabinet space by more than 30%.


Analog quantity I/O module: high-precision, low drift, multi-function

1. AI 240/A Analog Input Module

Channel and Resolution: 4-channel differential/single ended configurable voltage input, 14 bit resolution (1 LSB=1.3mV);

Signal range: ± 10V or 0-10V (ratio formula), supports external reference voltage (10V ± 2.5%, 20mA);

Accuracy index: Maximum error at 25 ° C ± 0.01% of full scale, temperature drift of only ± 5ppm/° C (typical), reaching laboratory level measurement level;

Diagnostic function: Sensor disconnection detection, reporting out of limit values when disconnected;

Input impedance: 10M Ω, no load effect on the sensor.

2. AO 240/A Analog Output Module

Channel and Resolution: 4-channel voltage output, 12 bit resolution (1 LSB=5.32mV);

Dynamic performance: Full range jump establishment time ≤ 50 μ s (resistive load), conversion period 1ms;

Driving capability: minimum load resistance of 1k Ω, maximum capacitive load of 10nF;

Accuracy: 25 ° C error ± 0.15% of full scale, temperature drift ± 20ppm/° C.

3. AM 28x/x analog hybrid module

Series design: Available in two specifications: voltage type (AM 280/A 14 bit, AM 282/A 16 bit) and current type (AM 280/B 14 bit);

Input characteristics: The 16 bit voltage input module (AM 282/A) achieves a measurement accuracy of 0.01%, with a temperature drift of 5ppm/° C, suitable for high-precision position/force closed-loop;

Output characteristics: The current output module (AM 280/B) supports 0~20mA/4~20mA, load resistance ≤ 600 Ω, and resolution of 12 bits (1 LSB=5.39 μ A);

Bus power consumption: The 24V bus has a maximum power consumption of 3.6W, while the 5V bus only has 0.3W, with an efficient power supply design.

IM 270/W Compact Module: Special "Super I/O" for Injection Molding Machines

IM 270/W is the most integrated single module solution in the KeConnect series, customized for complex machines such as injection molding machines and die-casting machines. Its function is equivalent to compressing traditional 8-10 independent modules into a single 270mm wide shell:

1. Numerical part

32 channel digital input: Type 1, minimum update cycle of 200 μ s, supports software debounce;

40 digital outputs: divided into 16 channels of 0.5A (100% simultaneous rate) and 24 channels of 2A (50% simultaneous rate). The 2A output group has 500V AC electrical isolation and anti reverse protection, and can directly drive proportional valves.

2. Analog component

8-channel 16 bit differential/single ended voltage input: ± 10V range, 100 μ s scanning period, second-order hardware filtering (2.5kHz) plus software filtering (500 μ s/1ms/5ms optional), accuracy ± 0.02%;

6-way 12 bit voltage output: ± 10V, conversion period of 100 μ s, establishment time ≤ 100 μ s.

3. Temperature measurement section

8-way isolated thermocouple input: supports J, K, L, N types, 16 bit resolution, adjustable measurement interval of 20/40/100ms;

Cold end compensation: built-in terminal temperature sensor, error ± 1 ° C; optional external TE 220/A sensor, error optimized to ± 0.5 ° C;

Isolation and voltage resistance: 500V AC isolation between channels and control systems to eliminate ground loop interference.

4. SSI interface

4-channel SSI absolute encoder interface: speed of 125k~1Mbit/s, 32-bit programmable frame length, supports binary/Gray codes;

Encoder power supply: 24V/250mA per channel, with self recovery short-circuit protection.

5. Real time communication

2-channel EtherCAT slave interface: 100Mbit/s, enables 200 μ s cycle data exchange with CPU, supports the concept of "fast control", and reduces dead time by more than 50%;

K-bus expansion port: The right side can be directly connected to the standard KeConnect C2 module for flexible expansion.


Temperature measurement module: Professional grade thermocouple and RTD acquisition

1. TM 220/A and TM 240/A thermocouple modules

Number of channels: 3 channels (TM 220/A) or 6 channels (TM 240/A), supporting J, K, and L types;

Cold end compensation: internal compensation (terminal temperature) or external TE 220/A high-precision compensation;

Special mode: Supports μ V direct display mode for easy on-site verification;

Accuracy: Maximum absolute deviation of ± 1.5 ° C at 25 ° C, and ± 2 ° C across the entire temperature range.

2. TM 225/A PT100 module

Channel and wiring: 4 channels, supporting 2-wire or 4-wire system, 4-wire system eliminates the influence of wire resistance;

Resolution: 14 bits, 1 LSB=0.058 ° C;

Constant current source: Each channel has an independent excitation current of 600 μ A;

Scanning cycle: 2ms, with 100ms sliding average filtering.


Positioning and motion control module

MM 240/A incremental encoder module

Dual channel input: supports 5V differential or 24V single ended encoders, with a maximum input frequency of 250kHz (differential);

Counting resolution: 32-bit position counter, maximum pulse rate of 1MHz in quadruple frequency mode;

Speed measurement: gate time method based on 50MHz time base, 24 bit speed register;

Latch function: 2-channel 24V latch input (source/drain configurable), response time of 20 μ s, timestamp resolution of 1 μ s;

Encoder power supply: 24V (100mA/channel) or internally generated 5V (5.05V ± 4%).


Communication module: Industrial fieldbus full coverage

1. Serial communication (SM 2x0/A&SX 2x0/A)

RS-232-C: 2-channel (SM 210/A) or 1-channel optional (SX 210/A), with a speed of 1.2-11.5kbit/s;

RS-422/485-A: 2-channel (SM 230/A) or 1-channel option (SX 230/A), software switching;

20mA current loop: SM 220/A and SX 220/A, active/passive compatible, with a line length of 1000 meters @ 9.6kbit/s.

2. SSI interface (SM 250/A)

4-channel SSI: speed of 125k~1Mbit/s, 32-bit resolution, 250mA sensor power supply per channel.

3. Fieldbus slave station

Profibus DP-V1 slave station (FM 265/A): speed of 9.6k-12Mbit/s, signal line isolation, limited to one CPU per unit;

CANopen (FM 200/A&FX 200/A): 1-2 channels, speed 125k~1Mbit/s, 9-pin D-sub;

Sercos III Master Station (FX 271/B): Used for CP 24x/26x, 100Mbit/s, integrated with 2 Ethernet switches.

4. Ethernet Expansion (NX 252/A)

PCI interface card, add a 10/100M RJ45 to CP 26x, and isolate the signal line.


Bus coupler: the core of distributed I/O

1. CANopen bus coupler (BL 210/B)

1-channel CANopen: The speed is set by a rotary switch (125k~1Mbit/s);

Power supply: Front end 24V input, maximum output power 45W@24V and 8.5W@5V ;

Protection: Full protection against reverse connection, overload, short circuit, and feedback.

2. EtherCAT slave coupler (BL 27x/x)

100Mbit/s EtherCAT: 2-channel RJ45, supporting ring network topology;

On board I/O: BL 27x/A with 4 digital inputs (interrupt capability of 100 μ s); BL 27x/B with 4 digital outputs (0.5A);

Bus via Bus: BL 272/x supports inserting communication modules such as FM 200/A and SM 210/A into remote I/O stations, achieving a complex topology of "bus backplane hanging bus slave stations".


Common Technology: Electronic Parameter Chip and Comprehensive Diagnosis

The Electronic Parameter Chip that runs through the entire series of modules is the intelligent symbol of KeConnect I/O

Plug and play: After the module is inserted, the CPU automatically reads the model, serial number, hardware version, and calibration data from the chip;

No jumper configuration: No hardware jumper is required, all filtering, debounce, interrupt enable and other parameters are issued by software;

Preventive maintenance: The chip records the cumulative power on time and switch frequency, and supports predictive maintenance.

Diagnostic ability stratification:

Channel level: digital output short circuit, overload; Analog input disconnection; Encoder disconnection;

Module level: power supply undervoltage, bus communication error;

System level: Implement collective diagnostic information transmission from remote I/O stations through bus couplers.


Environmental adaptability: Industrial grade rigorous certification

Working temperature:+5 ° C~+55 ° C (some modules can be extended to 0 ° C~+60 ° C);

Storage temperature: -40 ° C~+70 ° C;

Relative humidity: 10%~95%, no condensation;

Vibration and impact: fully comply with EN 61131-2 standard;

Protection level: IP20 (installed inside the control cabinet);

Safety certification: CE, UL 508, IEC 61131-2.


Application scenarios and selection suggestions

1. Plastic machinery (injection molding machine, blow molding machine)

First choice: IM 270/W single module covers all I/O requirements of the machine, and is matched with EtherCAT to achieve micrometer level voltage conversion accuracy;

Auxiliary: TM 240/A extended multi-channel material barrel temperature control; MM 240/A monitors the position of the ejector pin/adjustment motor.

2. Metal forming (die-casting machines, stamping machines)

DO 272/A drives high current hydraulic valve, with fast shut-off function to reduce impact;

FM 265/A is connected to the Profibus DP factory network to collect energy consumption and production data.

3. Material handling and packaging

Build a distributed picking station with BL 27x/A and DI 260/A to interrupt input and capture grabbing signals;

SM 230/A connects barcode scanners to achieve product traceability.

4. Renovation of old equipment

BL 210/B interfaces with existing third-party controllers through CANopen, retaining the original I/O module investment.

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