GE DS3800HLXA High-Speed Data Link Board

GE DS3800HLXA High-Speed Data Link Board

Part Number DS3800HLXA Manufacturer General Electric Country of Manufacture As Per GE Manufacturing Policy Series Mark VI/VIe Function Module Availability In StockDS3800HLXA is a high-speed data link board developed by GE. It is a part of Mark IV control system. The board has six connectors for fiber optic cables. It also has a single run-designated red LED indicator. A high-speed data link board, also known as a data communication board or data link interface board, is an electronic component used to facilitate fast and efficient data transfer between different devices or systems. 

The main purpose of a high-speed data link board is to provide a reliable and high-bandwidth pathway for transmitting data between devices at accelerated rates. They typically incorporate specialized hardware components and advanced communication protocols to achieve this objective. Features High Bandwidth: The board is designed to handle large amounts of data at high speeds, enabling fast data transmission and reduced latency. Advanced Communication Protocols: These boards often support various communication protocols, such as Ethernet, USB, PCIe, InfiniBand, or custom protocols tailored to specific applications. 

Error Correction and Data Integrity: To ensure data integrity during transmission, the board may employ error correction mechanisms and protocols like checksums, CRC, or FEC. Multiple Interface Options: Depending on the application, the board may offer different physical interfaces, such as optical fiber ports, copper connectors, or wireless options. Plug-and-Play Compatibility: Many data link boards are designed to be plug-and-play, making them easier to integrate into existing systems and reducing the need for extensive configuration. Buffering and Flow Control: To manage data flow between devices with different speeds or processing capabilities, the board may use buffering and flow control mechanisms to prevent data loss or congestion. 

 System Contact Outputs Solenoids (sheets 20A, etc.) and other external devices are driven by contacts from relays installed in relay modules . The relay driver module, RDM, contains the relay driver circuits. There are two types of relay driver circuits: voting and non-voting. Each relay driver circuit's logic is represented as a software contact on the relevant elementary. The output connections are either displayed on the same line as the relay coil or are placed elsewhere with the coil and contacts properly cross-referenced. The phrase 2/3 relay driver block symbol indicates voting type relay driver circuits. 

Each of the controllers, C, S, and T, sends a logic signal to the voting circuits. The agreement of two out of the three inputs received determines the output. The phrase l/l that appears above the relay driver block symbol designates non-voting relay driver circuits. The non-voting circuit controls the relay based on a single input logic signal. A solenoid filter circuit with the designation SSFG is used by the solenoid driver circuits.

OTHER INFORMATION

• Up to 1.26 GHz Pentium® III processor with 256 KB advanced  transfer cache  

• Up to 512 MB PC-133 SDRAM using a single SODIMM  

• Internal AGP SVGA controller with 4 MB display cache  

• 133 MHz system bus via Intel® 815E chipset  

• Dual Ethernet controllers supporting 10BaseT and 100BaseTX  interfaces  

• Optional PCI dual channel Ultra160 SCSI  

• Up to three (two with rear I/O support) PMC expansion sites  (IEEE-P1386 common mezzanine card standard, 5 V)  

• Up to 1 GB bootable flash on secondary IDE (optional)  

• Two 16-bit and two 32-bit programmable timers  

• 32 KB of nonvolatile SRAM  

• Software-selectable watchdog timer with reset  

• Remote Ethernet booting  

• Optional IDE hard disk drive  

• VME64 modes supported:  A32/A24/D32/D16/D08(EO)/MBLT64/BLT32  

• VMEbus interrupt handler, interrupter and system controller  

• Includes real time endian conversion hardware for littleendian and big-endian data interfacing (patent no. 6,032,212)  

• Enhanced bus error handling  

• Passive heat sink