ADLINK MXE-310 edge computing Platform Hardware Installation and BIOS Tuning

ADLINK MXE-310 Series Industrial edge computing Platform Hardware Deployment and BIOS Deep Tuning Guide

In harsh environments such as industrial automation, intelligent transportation, and machine vision, the stability and scalability of edge computing devices directly determine system level reliability. The MXE-310 series compact embedded platform launched by ADLINK is based on the 13th generation Intel Core processor, with an all aluminum alloy body, modular expansion design, and wide temperature working capability, making it an ideal choice to replace old industrial computers and upgrade production line control nodes. This article will provide a practical manual covering the entire lifecycle, from hardware disassembly and assembly, interface configuration, BIOS tuning to power consumption planning, to help engineers quickly complete the deployment process from unboxing to stable operation.

Unpacking and Hardware Overview

The size of MXE-310 host is 180mm × 130mm × 70mm, with standard wall bracket, DIN rail mounting screws, and quick guide. In addition to the host, users need to prepare their own 12V-24V DC power adapter (recommended above 60W to cope with 28W CPU full load scenarios). The front of the device integrates a power button (with blue LED), a reset button, three status LEDs (hard drive activity, diagnostic indicator, user-defined), and an audio interface (Line in/Line out/MIC in). The back panel provides two RJ45 Ethernet ports (LAN1 is Intel I219-V Gigabit, LAN2 is I225-V 2.5 Gigabit), one HDMI 2.1, one DisplayPort 1.4a, one USB Type-C (supports DP Alt Mode and 5V/3A power supply), four USB ports (one USB 3.2 Gen2, three USB 2.0), two DB9 serial ports (COM1/COM2 supports RS-232/422/485 mode switching, COM3/COM4 only RS-232), and one DB26 digital I/O interface (8 inputs, 8 outputs).

The internal motherboard is equipped with two DDR5 SO-DIMM slots (up to 64GB, 4800MHz) and reserves three M.2 expansion slots: Key-M (2280 size, PCIe Gen3 x2， Supports NVMe SSD and Key-B (3042 size, USB 3.0+2.0， Equipped with a USIM card slot for 4G/5G modules, Key-E (2230 size, PCIe x1+USB 2.0， Used for Wi Fi/Bluetooth). In addition, it also provides a standard SATA interface (6Gb/s) and SATA power supply internally, which can be used to install 2.5-inch SSDs/HDDs.

Expansion module and storage device installation

1. Installation steps for M.2 module

Remove the top four screws and open the heat sink (pay attention to the position of the internal thermal pad). Select the corresponding slot based on the module type:

Key-M: Insert NVMe SSD, push in at an oblique angle and press to secure, and lock with matching screws.

Key-B: When installing a WiMAX card, it is necessary to insert the SIM card into the Nano SIM card slot on the motherboard in advance (pay attention to the orientation of the metal contacts), and then fix the module.

Key-E: Install Wi Fi/BT module and connect the antenna (the antenna feeder needs to pass through the reserved hole on the body).

Re cover the heat sink, make sure the thermal pad is in good contact with the CPU/PCH, and tighten the four screws. If multiple modules are installed simultaneously, pay attention to the stacking height to avoid interference.

2. SATA SSD integration

After opening the top cover, secure the 2.5-inch SSD to the reserved stud and connect the SATA data cable and power cable (5V power supply). It is recommended to use industrial grade wide temperature SSDs to match the working environment of -20 ° C~60 ° C.

3. Wall mounted and DIN rail installation

Wall mounted: Use the two M4 screws provided to fix the wall mounted bracket on both sides of the host. The spacing between the bracket openings should be reserved according to the drawing to ensure that the mounting surface is firmly supported.

DIN rail (optional): Use M4 screws to fix the rail backplate to the back of the host. It should be noted that when using DIN rail installation, the system's vibration tolerance is reduced to 1G (standard wall mounting is 3G). If the on-site vibration is strong, it is recommended to use wall mounting or add shock-absorbing pads.

Heat dissipation requirements: The CPU and PCH are located on the left side of the body, in contact with the heat sink through a thermal pad. To ensure natural convection, leave at least 5cm (2 inches) of clearance below the equipment to avoid installation in enclosed spaces or close to heat sources.

Detailed configuration and signal definition of panel interface

1. Serial port mode switching (BIOS setting)

COM1 and COM2 can be selected in RS-232, RS-422, or RS-485 mode through the "Onboard Devices Configuration" menu in the BIOS. The pin definition is as follows (DB9 female head):

RS-232：2-RXD, 3-TXD, 5-GND, The others are DCD/DTR/DSR/RTS/CTS/RI.

RS-422:2-TXD - (or 422-), 3-TXD+(422+), 6-RXD -, 7-RXD+, 5-GND.

RS-485: 2-Data - (485-), 3-Data+(485+), 5-GND (half duplex, automatic direction control implemented by hardware).

If you need to connect to an RS-485 multi station bus, a 120 Ω terminal resistor (externally connected by the user) needs to be added at the end.

2. GPIO (DB26) pin allocation