Gefran GILOGIK II Distributed I/O System

Gefran GILOGIK II Distributed I/O System

Introduction: When Distributed I/O Becomes an Automation Bottleneck - The Alternative Value of GILOGIK II

In the field of industrial automation, distributed I/O systems play a critical role in connecting on-site sensors, actuators, and central controllers (PLC or IPC). However, many outdated systems, such as early Profibus DP, DeviceNet, or CAN networks, are limited by bandwidth, real-time performance, and scalability, gradually becoming bottlenecks in improving overall line efficiency. When the original fieldbus module is discontinued, communication failures occur frequently, or data refresh cycles cannot meet high-speed applications, engineers urgently need a new generation of distributed I/O architecture with nanosecond level synchronization, microsecond level refresh, modular and flexible expansion.

Gefran GILOGIK II is precisely the solution designed for this purpose. It is based on a 200 MHz ARM processor and parallel backplane bus, and can achieve 100 µ s I/O data refresh and zero jitter (jitter ≈ 0) synchronization performance at a system scale of up to 16 nodes and 256 I/O per node through proprietary GDNET real-time Ethernet protocol. Its modular gateway supports mainstream fieldbuses such as CANopen, DeviceNet, Profibus, and can directly connect to standard Ethernet networks.

This article will provide a detailed analysis of the system architecture, backplane and module installation, gateway configuration, I/O module selection of GILOGIK II from an engineering perspective, as well as replacement methods and troubleshooting strategies for discontinued distributed I/O systems from other brands.

System Overview: Core Competencies of GILOGIK II

2.1 Product positioning

GILOGIK II is a high-performance distributed I/O system suitable for scenarios such as machine automation, process automation, distributed control of large installations, data acquisition, production management, and building automation. Its design philosophy emphasizes:

High performance: 200 MHz ARM processor+parallel backplane bus → extremely short response time

High flexibility: The gateway can be configured with multiple fieldbuses, and I/O modules can be inserted into any slot (geographically addressed)

High reliability: module and on-site isolation, anti-interference; All wiring uses spring terminals without screws

Easy to maintain: Hot swappable module, pluggable wiring terminals, module replacement without rewiring

2.2 Architecture Composition

The entire system consists of the following parts:

Backboard (R-BUS series): Provides 4/8/12/18 slots, and modules are fastened into the backplane through screw free connectors. The backboard can be installed on a 35 mm DIN rail or directly fixed to the base plate.

Gateway node: responsible for communicating with the upper control system (such as PLC, PC, or GT-C human-machine interface) and managing the I/O modules on the backplane. Different gateways correspond to different fieldbus protocols.

I/O module: including specialized modules for digital, analog, temperature control, counting, etc.

Communication Expansion: R-ETH100 (Ethernet interface), R-SW5 (5-port industrial Ethernet switch, used for GDNET star/tree expansion), etc.

Human machine and control unit: GT-C (panel type industrial control computer, running software logic and HMI), GT-O (remote control panel), and GF-BOX (box type industrial control computer).

2.3 Key Performance Indicators

Backplane bus: 16 bit parallel, terminated, geographically addressed, modules do not require continuous insertion.

GDNET protocol: Based on standard Ethernet 100 Mbit/s, dedicated frame structure ensures deterministic transmission.

Refresh time: Single node I/O data refresh ≤ 100 µ s, multi node systems can still maintain a cycle of ≤ 1 ms.

Node capacity: Up to 16 nodes, with a maximum of 256 I/O points per node.

Power supply: The system is powered by a gateway module providing 24 Vdc/3 A power to the backplane, without the need for an additional power module.

Working environment: Operating at 0-50 ℃, stored at -20~70 ℃, humidity ≤ 90% without condensation, protection level IP20 (module body).

Backboard installation and grounding: a reliable starting point for foundation engineering

3.1 Backboard selection

Model, slot number, size (width x height x depth), mm, weight, order number

R-BUS4 4 104 × 110 × 30 120 g F026085

R-BUS8 8 208 × 110 × 30 240 g F026086

R-BUS12 12 size see manual - F026087

R-BUS18 18 size see manual - F026088

3.2 Installation method

Method 1: Install on Ω - shaped guide rail (35 mm)

Warning: It is strictly prohibited to clamp the backplane onto the guide rail while the module is already inserted, otherwise it may damage the module pins.

First fix the Ω guide rail to the bottom plate, then hook the upper teeth (tooth 1) of the back plate onto the edge of the guide rail, and rotate the back plate downwards until the bottom teeth (tooth 3) make a "click" sound to lock.

When disassembling, use a screwdriver or fingers to pull the release lever (lever 4) to disengage the bottom teeth, and then rotate it in the opposite direction to remove it.