OMRON Z500 high-precision contour measurement system

OMRON Z500 high-precision contour measurement system

Introduction: Technical bottlenecks and alternative needs of traditional contour measurement

In the process of industrial automation manufacturing, high-precision measurement of object contours is a key link in quality control. Traditional non-contact measurement methods usually rely on point displacement sensors to obtain height data by moving the measured object or the sensor itself. However, this approach exposes multiple systemic flaws in practical applications:

Mechanical motion introduces errors: Whether it is moving objects or sensors, measurement accuracy will decrease due to factors such as clearance, vibration, and uneven speed in the guidance system.

The system construction cost is high: it requires precision motion platforms and complex control systems, which increases equipment investment and maintenance costs.

Low measurement efficiency: The point by point scanning method is difficult to meet the real-time detection requirements of high-speed production lines.

To solve the above problems, a line beam method based on wide beam projection and two-dimensional CCD image sensing has emerged. This method can obtain the complete two-dimensional contour information of a certain section of an object at once without the need for relative motion, and has the characteristics of high accuracy, high stability, and high efficiency.

The working principle and system composition of the line beam method

2.1 Technical Principles

The core of the line beam method is to project a wide beam (line laser) onto the surface of the object being measured, and the reflected light is received by a two-dimensional CCD. The system analyzes the position distribution of reflected light on the CCD, calculates the height information of each point on the surface of the object, and reconstructs the two-dimensional contour.

Compared to traditional displacement sensors that can only obtain the height of "points", the line beam method directly obtains the contour of "lines", avoiding errors caused by mechanical scanning. The key advantages of this technology include:

No need to move: The measurement can be completed when the object and sensor are relatively stationary.

Wide adaptability: suitable for specular reflection, diffuse reflection, surfaces of different colors and materials.

High speed response: Fixed sampling period, suitable for dynamic process monitoring.

2.2 System composition

A typical line beam measurement system consists of the following components:

Sensor head: emits line laser and receives reflected light, with a built-in two-dimensional CCD.

Controller: processes image data, executes measurement algorithms, and outputs results.

Display screen (optional): Real time display of contour images, trend charts, numerical values, etc.

Cables and accessories: including sensor extension cables, monitoring cables, ferrite magnetic rings, etc.

The controller supports multiple input and output modes, including RS-232C, analog output (voltage or current), and digital IO trigger control. Its analog output resolution can reach 1/40000, with extremely high signal accuracy.

Detailed Product Series and Performance Parameter Interpretation

The following is a detailed specification of a typical line beam measurement system (such as OMRON Z500 series), covering key technical parameters such as measurement mode, distance, range, resolution, and light source type for different models.

3.1 Model Classification and Applicable Scenarios

According to the measurement distance and range, it is mainly divided into the following three sub models:

Model Mode Measurement Center Distance Measurement Range Applicable Scenarios

SW2T diffuse reflection/mirror reflection 5.2 mm/20 mm ± 0.8 mm/± 5 mm ultra precision close range detection

SW6 diffuse reflection/mirror reflection 50 mm/44 mm ± 4 mm/± 20 mm universal industrial testing

SW17 diffuse/mirror reflection 100 mm/94 mm ± 16 mm/± 16 mm long distance, wide range detection

3.2 Light source characteristics

SW2T: wavelength 650 nm, maximum output 1 mW, Class 2 laser.

SW6/SW17: wavelength 658 nm, maximum output 15 mW, Class 3B laser.

Note: Higher power lasers are available for special applications, please contact the supplier.

3.3 Beam size and measurement area

SW2T: 20 μ m × 4 mm (measurement area 2 mm)

SW6: 30 μ m × 24 mm (measurement area 6 mm)

SW17: 60 μ m × 45 mm (measurement area 17 mm)

3.4 Linearity and Resolution

Linearity: All models are ± 0.1% F.S. (full scale), but the reference material is different:

SW2T: Quartz glass (mirror) or SUS block (diffuse reflection)

SW6: SUS block

SW17: White alumina ceramic

Resolution:

SW2T: 0.25 μ m (average number of times 16)

SW6: 0.3 μ m (average number of times 64)

SW17:1.0 μ m (average number of times 64)

Attention: Resolution may decrease in strong magnetic field environments.

3.5 Sampling period and environmental adaptability

Fixed sampling period: 9.94 ms, suitable for real-time dynamic detection.

Temperature characteristics: 0.01% F.S./° C

Protection level:

SW2T：IP64

SW6/SW17: IP66 (better protection)

Work environment:

Temperature: 0-50 ° C

Humidity: 35-85% RH