3.3 Wide temperature range and environmental adaptability
As semiconductor equipment gas boxes become increasingly compact, the ambient temperature around MFCs may rise. The PS100 series adopts precision and low-power devices, expanding the temperature range of the operating environment to 15-50 ° C, adapting to more stringent internal environments of the machine.

Technical specifications and model description
4.1 Detailed Technical Specifications
Full range: 5 SCCM to 5 SLM (N ₂ equivalent flow rate)
Flow detection method: differential pressure measurement
Flow calibration: multi gas, multi range (11 BINs)
Stable time:<0.8 seconds (typical value<0.6 seconds)
Linearity:<± 0.5% F.S
Repeatability:<± 0.25% F.S
Leakage rate:<1 × 10 ⁻¹¹ Pa · m ³/s (He)
Range of work pressure (inlet):
Standard type: 230-600 kPa (abs)
Low vapor pressure type: 140-250 kPa (abs) (suitable for gases such as C ₄ F ₈)
Working pressure range (outlet): Vacuum to 60 kPa (abs)
Valve body type: normally closed piezoelectric actuator
Liquid receiving material: 316L stainless steel PCTFE、 Cobalt nickel alloy
Interface type: 92mm 1.125 inch C-seal or W-seal
Surface treatment: electrolytic polishing (Ra ≤ 0.2 μ m)/machined surface (Ra ≤ 0.8 μ m)
Weight: 1.1 kg
4.2 Electrical Interface and Communication
The PS100 series offers flexible signal interface options to adapt to different control system architectures:
Analog interface: Standard 9-pin D-Sub connector, supporting 0-5VDC setting/flow output signal.
Digital interface: Supports RS-485 and DeviceNet ™ Digital communication protocols facilitate integration into modern industrial networks.
Maintenance interface: All models are equipped with RS-485/Φ 2.5 three pole circular connectors for parameter monitoring and maintenance.
Power requirements: D-sub interface is+15VDC 90mA/-15VDC 60mA; DeviceNet ™ The interface ranges from+11VDC 300mA to+25VDC 150mA.
4.3 Model and suffix code
Users can select suitable product configurations based on specific process requirements, including:
flow range
gas type
Interface type (analog/RS-485/DeviceNet)
Type of joint (C-type seal/W-type seal)
Inlet/outlet pressure specifications (standard type/low vapor pressure type)
Special features (such as micro SD card, LCD display screen, etc.)
Application Fields and Value
The design of PS100 series MFC fully considers the complex requirements of modern semiconductor processes:
Etching process: high-precision and corrosion-resistant control of corrosive gases such as CL ₂, BCl ∝, HBr, etc.
Thin film deposition: Especially in atomic layer deposition processes, there are requirements for fast valve opening and ultra long lifespan.
Diffusion process: Stable and pollution-free transportation of gases such as SiH ₄ and NH ∝.
Research and development and multi variety small batch production: The compatibility of multiple gases and multiple ranges makes process development and conversion more flexible, without the need for frequent hardware replacement.
Summary
The Hitachi SAM PS100 series quality flow controller provides a powerful and reliable solution for the demanding gas control requirements in the semiconductor and advanced industrial fields with its innovative non heated pressure measurement architecture, excellent pressure insensitivity, high-precision and fast response, and robust valve design. It not only improves the accuracy and repeatability of process control, but also reduces the overall cost of equipment ownership through its flexible multi gas compatibility and long-life design. It is one of the key components driving the development of semiconductor manufacturing technology.
