The ASML 4022.474.2568.1 is a precision wafer table cleaning stone consumable engineered for ASML lithography systems. This specialized cleaning tool is designed to remove particulate contaminants, residue, and thin film deposits from the wafer table surface without causing damage or abrasion. Regular use of this consumable helps maintain the flatness and cleanliness of the wafer table, which is critical for achieving optimal focus, overlay accuracy, and defect‑free exposure in advanced semiconductor manufacturing.
The wafer table cleaning stone is a consumable item used during preventive maintenance procedures on ASML wafer stages. It is composed of a proprietary material that is non‑abrasive to the table's precision‑ground surface yet effective in lifting and removing stubborn contaminants. The stone is designed to be used with a specific cleaning solvent or deionized water, following a defined procedure to ensure thorough cleaning without introducing new particles.
Part Number: 4022.474.2568.1
Product Type: Wafer table cleaning stone
Material: Proprietary non‑abrasive composite
Dimensions: 50 mm x 25 mm x 10 mm
Weight: 0.05 kg
Application: Wafer table surface cleaning
Compatibility: ASML PAS, TWINSCAN series systems
Storage Conditions: Clean, dry environment (15 °C – 30 °C)
Shelf Life: 24 months from date of manufacture
Usage: Single‑use or multiple uses per procedure
The cleaning process using the 4022.474.2568.1 stone typically involves the following steps: the stone is moistened with a compatible cleaning solution, then gently wiped across the wafer table surface in a systematic pattern. The stone's material is designed to attract and lift particles from the surface, which are then removed with a clean wipe. This procedure is performed during scheduled maintenance intervals to restore the table's surface quality.
Contamination on the wafer table can lead to focus errors, overlay misalignment, and particle‑induced defects on the wafer. Regular cleaning with the appropriate consumable is essential for maintaining process stability and high yield. The 4022.474.2568.1 stone provides a safe and effective method for achieving the required cleanliness level without risking damage to the sensitive table surface.
This cleaning stone is used in:
Preventive maintenance of ASML wafer stages
After‑repair or after‑upgrade cleaning procedures
Routine cleanliness verification and table conditioning
Fabs running PAS and TWINSCAN systems
The cleaning stone should be stored in its original packaging until use to prevent contamination. Operators should wear cleanroom gloves when handling the stone to avoid transferring oils or particles. The stone should be discarded according to local regulations after its useful life, which is typically determined by visible wear or reduced cleaning effectiveness.
Each cleaning stone is manufactured under strict quality control processes to ensure consistent material properties and cleaning performance. The stones are certified particle‑free and meet ASML's specifications for consumable products used in cleanroom environments.
The 4022.474.2568.1 is compliant with RoHS directives and is free from substances that could contaminate the wafer or the cleanroom environment. The materials used are selected for minimal outgassing and compatibility with semiconductor processing conditions.
The ASML 4022.474.2568.1 wafer table cleaning stone is a critical consumable for maintaining the cleanliness and performance of ASML lithography systems. Its precise material composition and effective cleaning action contribute to reduced defect rates and improved process reliability.



