ADLINK PXES-2788 series chassis deployment and maintenance

ADLINK PXES-2788 Series Chassis Deployment and Maintenance Guide

In high power density applications such as aerospace, semiconductor testing, and power electronics, traditional PXIe chassis are often forced to reduce the number of modules or test throughput due to insufficient power budget per slot. The ADLINK PXES-2788 series was born for this purpose - based on PCIe Gen3 technology, it offers two configurations of 18 slots (PXES-2788) and 21 slots (PXES-2788E), with a system bandwidth of up to 24 GB/s. All peripheral slots support PCIe x8 Gen3 links (single slot 8 GB/s), and achieve a breakthrough of up to 102 W of power and heat dissipation per slot. The chassis adopts a dual power socket design (current sharing mode, non hot swappable), and can be optionally equipped with 2400 W or 1300 W power modules to meet the combination requirements of different input voltages and environmental temperatures. The cooling system provides standard version (3 × 210 CFM rear fan) and high-power version (additional 4 × 128 CFM overhead fan), combined with Normal/Boost dual-mode intelligent fan control, supporting stable operation at up to 55 ° C ambient temperature. The front panel SMA connector is used for 10 MHz reference clock input/output (replacing traditional BNC), providing convenience for high-precision synchronization. In addition, the chassis has a comprehensive safety shutdown mechanism - when the voltage exceeds ± 8%, the fan is below 600 RPM for 60 seconds, or the temperature exceeds 100 ° C for 3 seconds, it will automatically force power off and indicate serious faults through LED flashing frequency (0.5 second interval).

Product series and core specifications

The PXES-2788 series includes two sub models:

PXES-2788:18 slots (1 system slot+1 system timing slot+8 hybrid peripheral slots+8 PXIe dedicated peripheral slots)

PXES-2788E: 21 slots (1 system slot+1 system timing slot+8 hybrid peripheral slots+11 PXIe dedicated peripheral slots)

Both comply with the PXI-5 Rev. 1.1 specification and are compatible with PXI Express, CompactPCI Express, and hybrid slot compatible PXI-1/CompactPCI modules. The system slot (Slot 1) adopts a 2-link x8 x16 Gen3 architecture with a total bandwidth of 24 GB/s; All peripheral slots, except for Slot 19~21 of PXES-2788E which is x4 Gen3 (4 GB/s), are x8 Gen3 (8 GB/s).

Power specifications (key differences):

Power module options:

2400 W PSU (model CSU2400AP-3-XX): only supports 200-240 VAC input, suitable for high-power scenarios;

1300 W PSU (model FSP1300-29FM): Supports 100-240 VAC input, covering global voltage.

The dual power socket operates in current sharing mode (non hot swappable), which can increase the derating margin in high-temperature environments.

DC output rail:+12V,+3.3V,+5V, -12V,+5Vsb, load adjustment rate ± 5%, ripple noise of 120 mV, 50 mV, etc.

The maximum output power depends on the power supply model and input voltage, as detailed on page 4 of the manual.

Power and cooling capacity of each slot (Table 1-10):

Standard PXES-2788: Maximum 102 W/slot in Boost mode (requires an environment of 0-40 ° C and power consumption limitations for adjacent slots);

HP high-power models (with overhead fans) can support higher heat consumption.

Reference clock:

10 MHz (PXI_CLK10): inter slot skew ≤ 280 ps, accuracy ± 1 ppm, jitter 0.44 ps RMS;

100 MHz differential (PXIE_CK100): inter slot skew ≤ 100 ps, accuracy ± 1 ppm, jitter 2.41 ps RMS;

External 10 MHz input: SMA female socket on the front panel, requiring 10 MHz ± 25 PPM, amplitude of 100 mVpp~5 Vpp, high impedance input; Output amplitude 1 Vpp (50 Ω load) or 2 Vpp no-load, output impedance 50 Ω± 5 Ω.

Environment and Machinery: The operating temperature range varies depending on the configuration (0~55 ° C or 0~50 ° C), with a storage capacity of -40~71 ° C. The dimensions are 464.9 mm (including handle) × 194.8 mm × 482 mm, with a net weight of 11.9 kg. The noise level is 38.1 dBA in Normal Auto mode and 71.6 dBA in Boost High mode.

Installation and heat dissipation configuration

2.1 Unpacking and Accessories

The standard packaging includes a chassis, power cord (US/EU), and filler panel kit. The rack installation kit (part number 91-95126-0010, compatible with PXES-2780) needs to be purchased separately. Check for transportation damage.

2.2 Power Budget Calculation

Be sure to calculate the total power consumption of all modules (system controller+peripherals), which must not exceed the rated DC output of the selected power supply (see manual "DC Power Output"). At the same time, it is necessary to meet the current limit of each slot (Table 1-2): system slot+12V/30A,+3.3V/15A,+5V/15A, mixed slot+12V/6A,+3.3V/9A,+5V/6A, etc., with a maximum power of 102 W per slot. If using high-power modules (>60 W), attention should be paid to the power consumption limit of adjacent slots (some slots require<72 W).

2.3 Cooling gap and air duct

Airflow direction: rear intake, top exhaust (different from most chassis).

Minimum gap:

Rear: 101.6 mm (4 in.);

Top: Standard version 44.45 mm (1.75 in.), HP model (with overhead fan) requires 101.6 mm (4 in.).

All empty slots must be installed with filling panels, otherwise it will damage the wind pressure.