The ASML 4022.664.25702, 4022.478.00196, and 4022.478.00198 are SEM‑I‑311 interface modules configured as 9A2D. These modules provide comprehensive control and communication functions for ASML lithography systems, supporting wafer handling, alignment, and process automation. Designed for integration into advanced semiconductor manufacturing systems, these modules ensure reliable and precise operation.
This set of SEM‑I‑311 modules, configured as 9A2D, offers a complete interface solution for ASML lithography tools. Each module handles specific control tasks, including digital and analog I/O, communication bridging, and signal conditioning. Together, they form a robust interface between the system controller and peripheral devices.
Part Numbers: 4022.664.25702, 4022.478.00196, 4022.478.00198
Configuration: SEM‑I‑311=9A2D
Interface Type: SEM‑I‑311 (SEMI standard)
I/O Capacity: 24 digital inputs, 24 digital outputs, 8 analog inputs, 8 analog outputs
Communication Protocols: Ethernet, RS‑232, RS‑485, CAN
Power Supply: 24 VDC, 30 W per module
Operating Temperature: 0 °C to 50 °C
Protection Class: IP30
Dimensions: 19‑inch rack mountable, 3U height
Weight: 2.0 kg per module
The modules provide high‑speed data acquisition, real‑time control output, and diagnostic monitoring. They support both digital and analog signals, making them versatile for interfacing with sensors, motors, and actuators.
Configuration is performed via software, with support for custom scaling and filtering of analog signals. The modules are hot‑swappable for maintenance without system shutdown.
Used in ASML TWINSCAN, PAS series, and other lithography tools for interface management.
ASML provides technical documentation and support for these modules.
Complies with CE, RoHS, and SEMI standards.
The ASML SEM‑I‑311 module set offers comprehensive interface capabilities essential for lithography system control.



