ASML 4022.631.26719 Load Port Module – Automated Wafer Handling for Lithography Systems

The ASML 4022.631.26719 is a load port module configured as SEM‑I‑1310=9E41, incorporating components 4022.651.85972 and 4022.630.86784. This module provides automated wafer loading, alignment, and interface functions for ASML lithography systems, supporting efficient and reliable wafer handling in semiconductor manufacturing. Its advanced automation capabilities reduce manual intervention and improve throughput.

Overview of the Load Port Module

The load port module is the interface between the wafer carrier (FOUP or SMIF pod) and the lithography tool. It automatically opens the carrier, extracts wafers, and presents them to the handling robot for transport to the wafer stage.

Technical Specifications

• Lead Part Number: 4022.631.26719

• Included Components: 4022.651.85972, 4022.630.86784

• Configuration: SEM‑I‑1310=9E41

• Interface Type: SEM‑I‑1310 (SEMI standard)

• Wafer Size: 300 mm

• Wafer Carrier: FOUP (Front Opening Unified Pod)

• Throughput: Up to 100 wafers per hour

• Alignment Accuracy: ±0.1 mm

• Communication: Ethernet, DeviceNet, RS‑232

• Power Supply: 24 VDC, 400 VAC

• Operating Environment: Class 1 cleanroom

• Dimensions: 500 mm x 400 mm x 300 mm

• Weight: 35 kg

Automated Wafer Handling

The module includes a wafer mapping function, notch/alignment detection, and error handling for misfed wafers.

Interface and Integration

The load port interfaces with the system controller via SEMI standards, ensuring compatibility with ASML lithography tools.

Application Areas

Used in ASML TWINSCAN systems for automated wafer loading and unloading.

Installation and Configuration

Installation requires integration with the lithography tool's wafer handling system and software configuration.

Maintenance

Periodic cleaning and calibration of sensors and actuators are recommended.

Compliance

Complies with SEMI S2, CE, and RoHS standards.

Conclusion

The ASML load port module provides automated wafer handling essential for high‑throughput lithography systems.