SVG Silicon Valley Group ASML 28-43015-01 S90 Track CP Module – Precision Coating and Developing for Semiconductor Manufacturing

The SVG Silicon Valley Group ASML 28-43015-01 is an S90 track CP (Coating/Developing Process) module designed for use in semiconductor photolithography track systems. This module provides precise control of spin coating, developing, and baking processes, ensuring uniform photoresist film deposition and accurate pattern transfer. Its advanced automation capabilities and process control features make it a critical component in high‑volume wafer fabrication.

Overview of the S90 Track CP Module

The CP module is a key unit within the S90 track system, responsible for the application and development of photoresist on wafers. It integrates spin coater and developer stations, hot plates, and chill plates, all orchestrated by a sophisticated control system. The module's design emphasizes process reproducibility, low defectivity, and high throughput.

Technical Specifications

• Part Number: 28-43015-01

• Module Type: S90 track CP module

• Process Capabilities: Spin coating, developing, baking, chilling

• Wafer Size: 200 mm, 300 mm

• Spin Speed Range: 0 – 6000 rpm

• Temperature Control: ±0.5 °C (hot plates)

• Chemical Delivery: 4 pumps, 8 chemical lines

• Control System: PLC‑based with touchscreen HMI

• Communication: Ethernet, DeviceNet, RS‑232

• Power Supply: 400 VAC, 3‑phase, 3 kW

• Operating Environment: Class 1 cleanroom

• Dimensions: 1200 mm x 900 mm x 1800 mm

• Weight: 450 kg

Process Control Capabilities

The module's control system enables precise programming of spin speed, acceleration, and duration, as well as temperature ramping and chemical flow rates. It supports multiple process recipes for different resist types and film thickness targets.

Integration with Track Systems

The CP module is designed to integrate seamlessly into the S90 track platform, interfacing with the wafer handling robot and the central system controller. Communication protocols ensure coordinated operation.

Application Areas

Used for photoresist coating, developing, and baking in semiconductor wafer fabrication.

Installation and Maintenance

Installation requires cleanroom conditions and connection to facility utilities. Regular maintenance includes cleaning of spin bowls and calibration of temperature sensors.

Compliance

Complies with SEMI S2 safety standards and RoHS directives.

Conclusion

The SVG ASML 28-43015-01 S90 track CP module provides precision coating and developing capabilities essential for semiconductor manufacturing.