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  • GE DS3820HSMD Heat Sink Assembly Board
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  • GE DS3820HSMD Heat Sink Assembly Board

    110V-380V
    5W-130W
    1A-30A
    1 year
    30
    United States, France, Japan, Viet Nam, Australia, Russia, Germany, Italy, Arabia

    GE DS3820HSMD Heat Sink Assembly Board

    • ¥22500.00
      ¥24520.00
      ¥22500.00
      ¥22500.00
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      Review: 0

    Weight:2.500KG
    • Quantity:
    • (Inventory: 31)
Description

GE DS3820HSMD Heat Sink Assembly Board


GE DS3820HSMD Heat Sink Assembly Board

Part Number DS3820HSMD Manufacturer General Electric Country of Manufacture As Per GE Manufacturing Policy Series Mark VI/VIe Function Module Availability In StockDS3820HSMD is a Heat Sink Assembly Board developed by GE under Mark IV system. This board plays a critical role in heat dissipation and thermal management within the system, ensuring optimal performance and reliability of the components it supports. Features Specifically designed as a Heat Sink Assembly Board, emphasizing its crucial role in dissipating heat generated by various components within the Mark IV system. 

Heat sinks are essential to maintain the temperature of sensitive electronic components within safe operating limits, preventing overheating and potential damage. Features three male terminal connectors that serve as the primary interface for connecting the board with surrounding boards or components. Each connector plays a specific role in data and power transmission between the card and other parts of the system. Ten metal pins spaced out in pairs. These pins likely serve as electrical connectors for data and power signals, enabling efficient communication between the board and compatible boards or modules. The pair spacing might follow specific data protocols or bus configurations to support reliable and high-speed data transfer. The smaller white terminal features six metal pins, which may serve as additional input or output connectors, providing more connectivity options for specific functionalities or control signals. Offers approximately twenty ports, making it a versatile and comprehensive interface for connecting with other components or systems. 

These ports likely support various data, control, and power connections, enabling seamless integration and efficient operation. Optimized for effective heat dissipation. Its design and materials facilitate the rapid transfer of heat away from critical components, ensuring stable performance and preventing thermal-related issues that could lead to system malfunctions or failures. Proper thermal management is crucial in maintaining the overall health and longevity of the Mark IV system. The board's reliable thermal management capabilities ensure that sensitive components operate within their specified temperature ranges, reducing the risk of premature wear and extending the system's operational life. The male terminal connectors facilitate optimized board interconnectivity. By establishing secure and efficient connections with surrounding boards or modules, the component enhances the overall performance and coordination of the Mark IV system.

OTHER INFORMATION

• Available with either the 1.1 GHz, 1.6 GHz or 1.8 GHz  Pentium® M processor  

• 1.4 GHz Pentium M processor coming soon  

• Up to 2 Mbyte of advanced L2 cache  

• Up to 1.5 Gbyte DDR SDRAM  

• Up to 2 Gbyte bootable CompactFlash on secondary IDE (see  ordering options)  

• Internal SVGA and DVI controller  

• Serial ATA support through P2 rear I/O  

• 400 MHz system bus via Intel® 855GME chipset  

• Ethernet controller supporting 10BaseT and 100BaseTX  through the front panel  

• Gigabit Ethernet controller supporting 10BaseT, 100BaseTX  and 1000BaseT interface with optional VITA 31.1 support  

• Four asynchronous 16550 compatible serial ports  

• Four Universal Serial Bus (USB) Rev. 2.0 connections, two on  the front panel and two rear I/O  

• PMC expansion site (PCI-X, 66 MHz)  

• 32 Kbyte of nonvolatile SRAM  

• Operating system support for Windows® XP, Windows 2000,  VxWorks®, QNX® , LynxOS® and Linux

Features 

▪ Contains 10 Mbytes of battery-backed user memory and 10 Mbytes of non-volatile flash user  memory. 

▪ Provides access to bulk memory via reference table %W. 

▪ Configurable data and program memory. 

▪ Programming in Ladder Diagram, C, Structured Text, and Function Block Diagram. 

▪ Supports auto-located Symbolic Variables that can use any amount of user memory. 

▪ Reference table sizes include 32Kbits for discrete %I and %Q and up to 32K words each for  analog %AI and %AQ. 

▪ Supports Series 90-70 discrete and analog I/O, communications, and other modules. For a  list of modules supported, refer to the PACSystems RX7i Installation Manual, GFK-2223. 

▪ Supports all VME modules supported by Series 90-70. 

▪ Supports RX7i data monitoring over the web. Allows a combined total of up to 16 web server  and FTP connections. 

▪ Supports up to 512 program blocks. Maximum size for a block is 128KB. 

▪ Test Edit mode allows you to easily test modifications to a running program. 

▪ Bit-in-word referencing. 

▪ Battery-backed calendar clock. 

▪ In-system upgradeable firmware. 

▪ Three isolated serial ports: an RS-485 serial port, an RS-232 serial port, and an RS-232  Ethernet station manager serial port. 

▪ The embedded Ethernet interface provides: 

- Data exchange using Ethernet Global Data (EGD) 

- TCP/IP communication services using SRTP 

- Support for SRTP Channels, Modbus/TCP Server, and Modbus/TCP Client 

- Full programming and configuration services 

- Comprehensive station management and diagnostic tools 

- Two full-duplex 10BaseT/100BaseT/TX (RJ-45 Connector) ports with an internal network  switch providing auto-negotiated network speed, duplex mode, and crossover detection. 

- User-configurable Redundant IP address 

- Time synchronization to SNTP time server on Ethernet network (when used with  Release 5.00 or later CPU module).

   

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