The Ramix PMC237C-008EMI is a rugged 6U VME carrier board engineered for one conduction-cooled PMC module. It is designed for extreme environments where air cooling is not feasible and electromagnetic interference (EMI) must be tightly controlled. The board includes integrated EMI shielding gaskets and uses conduction cooling paths to transfer heat from the PMC module to the VME chassis.
Form Factor: 6U VME (single slot)
PMC Slots: 1 (conduction-cooled, IEEE 1386.1 compliant)
PCI Bus: 33 MHz, 32/64-bit, 3.3V or 5V
VME Interface: VME64x (A16/A24/A32, D08/D16/D32/D64, MBLT64)
Cooling: Conduction-cooled via wedge-locks
EMI Shielding: Integral EMI gaskets on front panel and injector/ejector handles
Operating Temperature: -40°C to +85°C (conduction)
Storage Temperature: -55°C to +125°C
Shock & Vibration: MIL-STD-810G, 40G shock, 5G random vibration
Power Supply: +5V, +3.3V, ±12V from VME backplane
Dimensions: 233 × 160 × 20 mm (with wedge-locks)

The PMC237C-008EMI uses a thermal management system that conducts heat from the PMC module through the carrier board into the VME chassis walls via wedge-locks. This eliminates the need for fans, making the board suitable for sealed, dust-tight enclosures and applications with high altitude or high G-forces. The board's aluminum core provides a low-thermal-resistance path.
The carrier features conductive gasketing around the front panel and along the card guides to maintain EMI shielding integrity when installed in a VME chassis. This reduces radiated emissions and improves immunity to external interference, which is critical for military communications and sensitive instrumentation.
This carrier board is used in airborne radar systems, ground vehicle computers, naval fire control systems, and industrial automation in high-temperature or dirty environments. It allows VME systems to host high-performance PMC modules such as FPGA accelerators, high-speed data converters, or crypto engines in mission-critical applications.



