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  • ABB P-HA-MSC-APC10120 Harmony I/O Fan Assembly
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  • ABB P-HA-MSC-APC10120 Harmony I/O Fan Assembly

    110V-380V
    5W-130W
    1A-30A
    1 year
    30
    United States, France, Japan, Viet Nam, Australia, Russia, Germany, Italy, Arabia
    P-HA-MSC-APC10120 Harmony I/O Fan Assembly
    • ¥1347.00
      ¥9763.00
      ¥1347.00
      ¥1347.00
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      Review: 0

    Weight:2.000KG
    • Quantity:
    • (Inventory: 2)
Description
P-HA-MSC-APC10120 Harmony I/O Fan Assembly

ABB P-HA-MSC-APC10120 Harmony I/O Fan Assembly

Basic information

Model and name: ABB P - HA - MSC - APC10120 Harmony I/O Fan Assembly, where ‘P - HA - MSC - APC10120’ is the model number used to accurately identify this fan assembly within the ABB product family. The ‘Harmony I/O Fan Assembly’ indicates that this is a fan assembly designed for Harmony I/O devices and is primarily used to dissipate heat from the device.

Family: Belongs to ABB's family of components for Harmony I/O devices. This series contains a variety of accessories related to Harmony I/O devices, such as power supply modules, interface modules, etc. These components work together to ensure that Harmony I/O devices operate properly.

Application Scenario: This fan assembly is a customised cooling solution for ABB Harmony I/O devices. By mounting it on the device, it promotes air flow, removes heat generated during operation, and ensures that the device operates within the appropriate temperature range, thus improving the stability and service life of the device.

Functionality

Heat dissipation function

Efficient heat exchange: This fan assembly adopts an optimised design, which can effectively promote heat exchange inside and outside the equipment. Factors such as the shape, number and angle of its fan blades are carefully designed to ensure that sufficient airflow is generated to carry away heat. For example, the fan blades may have a special wing design that improves air flow efficiency, allowing more cool air to flow quickly through the heat-generating parts of the unit.

Even distribution of heat: In addition to removing heat from the equipment, it also provides a degree of more even heat distribution within the equipment. This helps to avoid the occurrence of localised overheating, which may have a serious impact on the performance and lifetime of electronic components. Through reasonable airflow organisation, cold air can fully contact each hot spot inside the device to achieve balanced heat distribution.

Compatibility and Adaptability

Precise adaptation to Harmony I/O devices: Designed to closely match ABB Harmony I/O devices, it has a high degree of compatibility in terms of dimensions, mounting methods and electrical interfaces. Installation is simple and easy, and can usually be carried out directly on the device in the specified location without additional complex modifications. For example, the mounting bracket size and holes are perfectly matched to the Harmony I/O device's housing, ensuring that the fan assembly is securely mounted on the device.

Accommodates multiple device configurations: The cooling needs of Harmony I/O devices of different configurations and sizes can be accommodated. Whether it's a simple, small I/O system or a complex I/O architecture with a large number of modules, the fan assembly provides effective thermal support. This is because its cooling capabilities are designed to account for differences in heat generation with varying device loads and number of modules.

Reliability and Durability

High-quality fan motors: Equipped with high-quality fan motors for good performance and reliability. The internal structure of the motor is made of high-quality materials and precision manufacturing processes to ensure stable operation over a long period of time. For example, the motor's windings may be made of high-purity copper to reduce resistance and heat generation, while the bearing system is specially designed to withstand long periods of continuous operation, reducing wear and tear and the probability of failure.

Complete protection: A variety of protection measures are available to effectively prevent dust, moisture and other harmful substances from damaging fan components and equipment. For example, the air inlet may be fitted with an efficient dust filter that filters out most of the dust particles, while the housing of the fan assembly may be made of waterproof and moisture-resistant materials to adapt to different working environments.

Technical Parameters

Mechanical parameters

Dimensions: Dimensions are based on the installation space requirements of the Harmony I/O device. Specific dimensions may vary depending on the device model, but in general, fan assemblies may range from 8 - 15 cm in diameter and 3 - 8 cm in height, which is a good fit for most Harmony I/O device housing configurations.

Weight: Light weight, typically in the 0.5 - 2kg range, allows it to be mounted on equipment without overburdening the structure and is easy for the installer to handle.

Electrical parameters

Operating Voltage: The operating voltage is typically matched to the power supply system of the Harmony I/O device, typically 24V DC or other common industry standard voltages to ensure a stable power supply from the device's power system.

Operating Current and Power: The operating current is typically between 0.3 - 1.5A depending on the power of the fan, and the power is typically between 5 - 30W. These parameters ensure that the fan provides sufficient cooling capacity without overloading the device's power supply.

Thermal Performance Parameters

Airflow: Airflow is one of the most important indicators of a fan's ability to dissipate heat. The fan assembly's airflow is typically between 30 - 150 CFM (cubic feet per minute), which is sufficient to ensure that the heat inside the device is removed in a timely manner.

Noise level: Under normal operating conditions, the noise level is low, usually between 35 - 55 decibels, a range that does not significantly disturb the surrounding work environment and indicates smooth operation of the fan.

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