IC693TCM302B Advanced Temperature Control Module
Operating Temperature Range:-40"C to +85"C Accuracy:+/- 1% of full scale Input Type:4-20 mA or 0-10 VDC Power Consumption:Max. 5 W Communication Interface:RS-485 Modbus RTU Mounting Style:Panel mount Dimensions (WxHxD):105mm x 90mm x 45mm Weight:0.3kg Unmatched Precision Designed for critical applications requiring high accuracy in temperature control. Robust Construction The IC693TCM302B is built with rugged materials to withstand harsh industrial environments. Ease of Integration Featuring an RJ-11 connector for seamless integration into existing control systems. Versatile Applications Suitable for use in a wide range of industries including food processing, pharmaceuticals, and chemical manufacturing.
Efficient Energy Use Low current consumption ensures minimal power usage without compromising performance. The GE IC693TCM302B Temperature Control Module is a state-of-the-art solution designed for precise temperature control applications, ensuring optimal performance across various industrial environments.
OTHER INFORMATION
• Up to 1.26 GHz Pentium® III processor with 256 KB advanced transfer cache
• Up to 512 MB PC-133 SDRAM using a single SODIMM
• Internal AGP SVGA controller with 4 MB display cache
• 133 MHz system bus via Intel® 815E chipset
• Dual Ethernet controllers supporting 10BaseT and 100BaseTX interfaces
• Optional PCI dual channel Ultra160 SCSI
• Up to three (two with rear I/O support) PMC expansion sites (IEEE-P1386 common mezzanine card standard, 5 V)
• Up to 1 GB bootable flash on secondary IDE (optional)
• Two 16-bit and two 32-bit programmable timers
• 32 KB of nonvolatile SRAM
• Software-selectable watchdog timer with reset
• Remote Ethernet booting
• Optional IDE hard disk drive
• VME64 modes supported: A32/A24/D32/D16/D08(EO)/MBLT64/BLT32
• VMEbus interrupt handler, interrupter and system controller
• Includes real time endian conversion hardware for littleendian and big-endian data interfacing (patent no. 6,032,212)
• Enhanced bus error handling
• Passive heat sink




