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  • GE IS200EXCSG1A Exciter Conduction Sensor Board
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  • GE IS200EXCSG1A Exciter Conduction Sensor Board

    110V-380V
    1A-30A
    5W-130W
    1 year
    30
    United States, France, Japan, Viet Nam, Australia, Russia, Germany, Italy, Arabia

    GE IS200EXCSG1A Exciter Conduction Sensor Board

    • ¥28650.00
      ¥29856.00
      ¥28650.00
      ¥28650.00
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    Weight:3.200KG
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    • (Inventory: 31)
Description

GE IS200EXCSG1A Exciter Conduction Sensor Board


GE IS200EXCSG1A Exciter Conduction Sensor Board

Part Number IS200EXCSG1A Manufacturer General Electric Country of Manufacture As Per GE Manufacturing Policy Series EX 2100e Function Module Availability In StockIS200EXCSG1A is an Exciter Conduction Sensor Board manufactured and designed by General Electric as part of the EX2100 Series used in Excitation Control Systems. The EX2100 Excitation Control uses the IS200EXCS Conduction Sensor Board (EXCS) to detect bi-directional current flowing over a bus line. The IS200EGPA Exciter Gate Pulse Amplifier Board (EGPA) supplies the board with power, and it also filters the EXCS board's output before sending it to the IS200EMIO Exciter Main Input/Output Board (EMIO). 

 The EXCS board detects current using two unidirectional Hall Effect sensors facing opposite directions. Depending on the existence of a magnetic field, these sensors generate a logical output. A logical low output is generated by the circuit when either sensor detects a magnetic field that is greater than the operating threshold of the sensor (indicating current). When the field dips below the release point, the sensor will continue to operate in this low output mode. 

 Circuit Interconnect The board has gapped steel rings affixed to it in order to monitor current flow. These circles are traversed by the bus route. The concentrated magnetic flux generated within the rings is measured by the Hall Effect sensors on the circuit board. The EXCS board is mounted directly to the bus line and the steel rings are held in place by a plastic mounting bracket. A power supply input of +12.0 V dc 5%, 0.3 watts at most, and a 12 V dc return is needed for the EXCS board. The EGPA board is the source of these. For redundancy, the EGPA board receives two identical logical output signals from the EXCS board. Logic high outputs are above 11 V dc while logical low outputs are less than 1.2 V dc. 

The 4-pin P1 connector is used to connect all inputs and outputs to the EGPA board. Three EXCS boards, one for each bus line, are powered by the EGPA board. It transfers the information to the EMIO board after filtering the output signals from each of the EXCS boards. APPLICATION DATA: The Power Conversion Module (PCM) cabinet holds the EXCS board, which is devoid of fuses, testpoints, LED indications, and movable hardware. P1 is the only 4-pin connector on the board.

SPECIFICATIONS

Part No: IS200EXCSG1A
Manufacturer: General Electric
Function: Sensor Board
Series: EX2100
Operating temperature: -28 to 55°C
Board Size: 6.25 in x 4.25 in
Availability: In Stock
Product of Origin: USA
Manual: GEI-100510

OTHER INFORMATION

• Up to 1.26 GHz Pentium® III processor with 256 KB advanced  transfer cache  

• Up to 512 MB PC-133 SDRAM using a single SODIMM  

• Internal AGP SVGA controller with 4 MB display cache  

• 133 MHz system bus via Intel® 815E chipset  

• Dual Ethernet controllers supporting 10BaseT and 100BaseTX  interfaces  

• Optional PCI dual channel Ultra160 SCSI  

• Up to three (two with rear I/O support) PMC expansion sites  (IEEE-P1386 common mezzanine card standard, 5 V)  

• Up to 1 GB bootable flash on secondary IDE (optional)  

• Two 16-bit and two 32-bit programmable timers  

• 32 KB of nonvolatile SRAM  

• Software-selectable watchdog timer with reset  

• Remote Ethernet booting  

• Optional IDE hard disk drive  

• VME64 modes supported:  A32/A24/D32/D16/D08(EO)/MBLT64/BLT32  

• VMEbus interrupt handler, interrupter and system controller  

• Includes real time endian conversion hardware for littleendian and big-endian data interfacing (patent no. 6,032,212)  

• Enhanced bus error handling  

• Passive heat sink


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