XYCOM XVME-674 VMEbus Single Slot CPU/Processor Module Targeting high reliability scenarios such as industrial automation, process control, manufacturing, and robotics. It adopts a PC/AT compatible architecture, which provides traditional PC computing power while being compatible with the real-time characteristics of VME bus, and can run stably for a long time in harsh environments.ial device connection capability in industrial automation, process control, and data acquisition systems. It is usually used as a slave board, inserted into the VME chassis, and controlled and data exchanged by the main CPU board (such as XVME-976) through the VME bus.
Product positioning: Targeting high reliability scenarios such as industrial automation, process control, manufacturing, and robotics. It adopts a PC/AT compatible architecture, which provides traditional PC computing power while being compatible with the real-time characteristics of VME bus, and can run stably for a long time in harsh environments.
Main technical parameters
Processor: There are models such as 33MHz 80486DX and 66MHz 80486DX2, and some information mentions a 25MHz Motorola 68040.
Memory: Available in 4MB, 16MB, 32MB DRAM, and some models come with 2MB SRAM.
Storage: Built in IDE hard disk controller and floppy disk controller, can directly mount hard disks and floppy disks.
Display: Equipped with VGA graphics controller, supporting standard display output.
Interface: It has 2 x RS-232 serial ports, 1 x parallel port, and also includes a VMEbus interrupt circuit, supporting 7 levels of interrupts.
Power supply: There are different versions available, including 220V AC and 24V DC.
Working temperature: -40 ° C~85 ° C, with military grade anti vibration and anti impact capabilities.
Size/Weight: Single slot, weighing approximately 0.55kg.
Product Features
High reliability: Using military grade components and a wide temperature range design, suitable for extreme industrial sites.
Modular and Scalable: Through the VME slot, I/O, communication, storage and other expansion cards can be flexibly added to achieve customized functions.
Multi protocol compatibility: Supports VME64x, VMEbus standards, and common industrial protocols such as Ethernet, RS-232/485, USB, etc. It is compatible with XYCOM and other brands of VME devices.
Development friendly: Provides cross platform SDK and Linux/RTOS drivers, which can shorten the secondary development cycle.
Hardware health monitoring: Equipped with temperature, voltage and other sensors, it can achieve predictive maintenance and fault warning.
Typical application areas include industrial automation control (such as PLC, DCS, fieldbus gateway), manufacturing and robotics (real-time motion control, machine vision processing), power and energy (power plant monitoring, distribution automation), process control (continuous production processes in chemical, petroleum, metallurgy, etc.), as well as embedded computing platforms that require high reliability and anti-interference in military and aerospace industries.
Precautions
Precautions for installation and disassembly
Before operation, the main power supply of the system must be cut off and an anti-static wristband must be worn to avoid electrostatic breakdown of precision components inside the module; It is strictly prohibited to plug or unplug modules while they are live.
Ensure that the module is perfectly aligned with the VME bus slot, and push the module evenly into the slot to avoid violent insertion and removal that may cause wear on the gold fingers or deformation of the slot pins.
When fixing the module, it is necessary to tighten the locking screws on both sides of the panel to prevent the module from loosening or poor contact due to vibration, which may affect system stability.
Environmental usage precautions
Although the module supports wide temperature operation from -40 ° C to 85 ° C, it should be avoided to operate at extreme temperatures for a long time. High temperature environments require supporting cooling fans or fins, while low-temperature environments require proper equipment insulation to prevent condensation.
The working environment should be kept dry and dust-free, avoiding the intrusion of dust, corrosive gases (such as acidic and alkaline gases in chemical environments), and oil stains into the interior of the module, which can cause corrosion or short circuit of the circuit board.
The module has military grade anti vibration and anti impact capabilities, but it still needs to avoid frequent severe vibrations and impacts, especially during equipment transportation or on-site installation, and shock absorption protection needs to be done well.
Precautions for Electrical Connections
The power supply must strictly match the module specifications (220V AC or 24V DC version), and it is strictly prohibited to connect the voltage incorrectly, otherwise the module will be directly burned out; It is recommended to install fuses and surge protectors in the power supply circuit to prevent damage to the module caused by voltage fluctuations, lightning strikes, etc.
When connecting external interfaces such as serial and parallel ports, it is necessary to confirm that the signal definition matches the external device to avoid reversing the signal line; Communication cables should be shielded and kept away from strong electromagnetic interference sources (such as frequency converters and high-power motors) to prevent signal interference.
When connecting storage devices such as IDE hard drives/floppy disks, it is necessary to ensure that the data and power cables are firmly connected to avoid data read/write failures or storage device damage caused by poor contact.
Precautions for operation and maintenance
During the operation of the module, temperature, voltage and other parameters can be monitored through built-in sensors. If there are any abnormal parameters (such as high temperature or voltage fluctuations exceeding the threshold), the fault should be promptly investigated to prevent module damage.
Regularly clean the dust on the surface of the module and the heat dissipation holes. When cleaning, compressed air (pressure should not be too high) or anti-static brushes can be used. It is forbidden to use liquid cleaning agents to directly rinse the module.
When upgrading firmware or updating drivers, it is necessary to strictly follow the official operation manual provided, avoid using unofficial firmware or drivers, and prevent module malfunction or failure to start.
Storage and transportation precautions
When storing modules for a long time, they should be placed in anti-static packaging bags and stored in a dry environment with a temperature of 0 ° C~40 ° C and a humidity of 20%~80%, avoiding direct sunlight and humid environments.
During transportation, it is necessary to use original packaging or packaging boxes with shock-absorbing and anti-static functions to prevent the module from being crushed, collided, and damaged by static electricity.
Other precautions
It is strictly prohibited to dismantle the module casing or modify the internal circuit without authorization, otherwise it will result in the expiration of the product warranty and may cause safety hazards.
When the module is scrapped, it should be recycled according to the industrial electronic waste disposal standards to avoid heavy metal pollution in the circuit board environment.





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