YOKOGAWA SR1030B62-3MN * 1C is an industrial grade high-frequency signal processor developed by Yokogawa Electric Corporation in Japan specifically for high-frequency signal measurement and control scenarios. It can be seamlessly integrated into CENTUM VP distributed control systems and various industrial automation platforms. The core function of this product is to perform high-precision acquisition, real-time filtering, fast processing, and standardized output of high-frequency analog signals (such as high-frequency vibration, high-speed flow pulses, high-frequency voltage/current signals, etc.) in industrial sites, providing high fidelity and low latency signal data support for system controllers. Based on the core technology of Yokogawa Electric in the field of high-frequency signal processing, the module adopts dedicated high-frequency signal conditioning circuits and high-speed processing chips, which have the characteristics of wideband response, low noise, and strong anti-interference ability. It is widely used in industrial scenarios such as aerospace testing, precision manufacturing equipment monitoring, high-frequency power electronic equipment regulation, and high-speed fluid measurement that require strict signal processing bandwidth and real-time performance.
Product Overview
YOKOGAWA SR1030B62-3MN * 1C is an industrial grade high-frequency signal processor developed by Yokogawa Electric Corporation in Japan specifically for high-frequency signal measurement and control scenarios. It can be seamlessly integrated into CENTUM VP distributed control systems and various industrial automation platforms. The core function of this product is to perform high-precision acquisition, real-time filtering, fast processing, and standardized output of high-frequency analog signals (such as high-frequency vibration, high-speed flow pulses, high-frequency voltage/current signals, etc.) in industrial sites, providing high fidelity and low latency signal data support for system controllers. Based on the core technology of Yokogawa Electric in the field of high-frequency signal processing, the module adopts dedicated high-frequency signal conditioning circuits and high-speed processing chips, which have the characteristics of wideband response, low noise, and strong anti-interference ability. It is widely used in industrial scenarios such as aerospace testing, precision manufacturing equipment monitoring, high-frequency power electronic equipment regulation, and high-speed fluid measurement that require strict signal processing bandwidth and real-time performance.
Core technical parameters
2.1 Basic electrical parameters
-Processor performance: Equipped with a high-performance 32-bit RISC processor, the core computing speed is divided into a 25MHz basic version and a 1GHz enhanced version, which can be flexibly selected according to the complexity of the control scenario; Support multi task parallel processing, capable of efficiently executing complex control algorithms (such as PID regulation, fuzzy control) and real-time processing of large-scale data.
-Memory configuration: The basic memory capacity is 512KB, and the enhanced version can be expanded to 2GB. The program storage area and data storage area are independently divided, supporting online program modification and data power failure protection, ensuring the security of control logic and the integrity of data.
-Rated power supply: using 24V DC power supply, the allowable range of power fluctuation is 18V DC~30V DC, the typical power consumption is 12W, and the standby power consumption is ≤ 3W. The power supply end integrates EMI filtering circuit and surge protection module, which can effectively resist industrial power grid interference and ensure stable operation in unstable power supply environment.
-Core processing performance: Equipped with a high-speed 32-bit floating-point DSP processor, the core operation frequency reaches 500MHz, supports single instruction multiple data (SIMD) operations, and can achieve real-time parallel processing of high-frequency signals; Built in 8MB high-speed cache and 512MB Flash storage ensure fast read/write and power-off saving of high-frequency data.
-High frequency signal processing parameters: The signal processing bandwidth is 10Hz~1MHz, supporting full bandwidth acquisition and processing of high-frequency signals; Using a 24 bit high-precision A/D conversion chip, the conversion rate reaches 1MSPS (millions of samples per second), the conversion error is ≤± 0.02% FS, and the temperature drift coefficient is ≤± 5ppm/℃, ensuring the accuracy and stability of high-frequency signal acquisition.
-Channel configuration: Standard configuration includes 8 differential high-frequency analog input channels, with optoelectronic isolation design between channels (isolation voltage ≥ 500V AC), and channel to ground isolation voltage ≥ 1kV AC, effectively suppressing inter channel crosstalk and ground loop interference; Supports channel synchronous sampling with a synchronization error of ≤ 10ns, suitable for collaborative measurement and control scenarios of multi-channel high-frequency signals.
2.2 I/O interface characteristics
The module has rich high-frequency signal adaptation and processing capabilities, and can be directly connected to various high-frequency sensors and signal sources in industrial sites. At the same time, it integrates multiple high-frequency signal processing algorithms. The specific characteristics are as follows:
-Support signal types: compatible with high-frequency voltage signals (0~10V, ± 5V, ± 10V) and high-frequency current signals (4~20mA, 0~20mA); Supports high-frequency vibration sensor signals (ICP/IEPE accelerometer signals with built-in 2mA constant current excitation) and high-speed pulse signals (frequency ≤ 1MHz); Support differential input signals, common mode rejection ratio (CMRR) ≥ 80dB@50Hz Effectively enhance the anti-interference ability of high-frequency signals.
-High frequency signal processing characteristics: Built in programmable digital filtering function, supporting multiple filtering types such as low-pass, high pass, band-pass, notch, etc. The filtering cutoff frequency can be accurately configured through software (10Hz~1MHz); Integrated FFT (Fast Fourier Transform) analysis function, capable of frequency spectrum analysis of high-frequency signals with a spectral resolution of ≤ 1Hz; supports real-time calculation of various characteristic parameters such as peak value, effective value, average value, peak factor, etc., with a data update cycle as low as 1ms; has signal trigger acquisition function, supports multiple trigger modes such as level trigger, edge trigger, pulse width trigger, etc., suitable for precise capture scenarios of high-frequency signals.
2.3 Communication Parameters
The module adopts a high-speed communication interface design to ensure low latency transmission of high-frequency processed data, while also possessing complete communication diagnosis and interconnection capabilities. The specific parameters are as follows:
-Communication interface: standard Gigabit Ethernet interface (RJ45) and Yokogawa dedicated V-net/IP high-speed bus interface; Gigabit Ethernet supports 1000Mbps high-speed data transmission with a maximum communication distance of 100m; V-net/IP bus transmission rate reaches 1Gbps with a maximum communication distance of 10km (fiber optic transmission), suitable for the networking requirements of large-scale high-frequency signal measurement and control systems.
-Support protocols and data transmission: compatible with mainstream industrial communication protocols such as TCP/IP, UDP, Modbus TCP, Profinet, and also supports the Yokogawa CENTUM VP system specific protocol; Support real-time streaming transmission of high-frequency data with a transmission delay of ≤ 5ms; have data packet transmission and CRC verification functions to ensure the integrity and reliability of high-frequency large data transmission; Support remote control command issuance, signal processing parameters and start/stop signal acquisition can be remotely configured through the upper computer.
2.4 Environmental and Physical Parameters
-Working environment: The working temperature range is -10 ℃~+60 ℃, and the wide temperature version supports -40 ℃~+85 ℃; The relative humidity tolerance range is 5%~95% (without condensation); Capable of resisting vibration (1g RMS, 10-1000Hz) and impact (20g, 11ms half sine wave); Electromagnetic compatibility complies with IEC 61000-4-2/3/4/5/6 standards, with anti-static discharge (± 8kV contact discharge), surge (± 2kV line ground), and radio frequency interference capabilities, and can adapt to the high-frequency electromagnetic environment of complex industrial sites.
-Storage environment: Storage temperature range is -40 ℃~+85 ℃, storage relative humidity is ≤ 95% (no condensation); The storage environment should be kept away from corrosive gases, strong electromagnetic fields, dust, and organic solvents. During transportation, the original buffer packaging box should be used to avoid severe collisions and bumps, and to prevent damage to high-frequency circuit components.
-Physical dimensions: The standard dimensions are 180mm × 150mm × 80mm, adopting a dual-mode design of standard DIN rail installation and panel installation; The weight is about 1.2kg, the structure is compact, which can save the installation space of the control cabinet and adapt to the layout of dense high-frequency measurement and control systems.
Maintenance and Precautions
Key points of daily maintenance
-Regular inspection: During daily inspections, observe the module status indicator light and LCD display screen to confirm that the power light (green constant light), running light (green flashing), and synchronization light (green constant light) are normal, and there is no alarm light (red) on; Check if the module wiring terminals and cable joints are secure, observe if the high-frequency cable shielding layer is intact and if the grounding is reliable, and promptly address any issues found; Check the real-time signal waveform and spectrum through the upper computer to confirm that the signal acquisition and processing are normal.
-Cleaning and maintenance: Regularly (recommended monthly) clean the module, and disconnect the power before cleaning; Wipe the surface of the module, indicator lights, and LCD display screen with a clean and soft dry cloth. Do not use organic solvents, acidic or alkaline cleaning agents; Regularly clean the dust from the ventilation openings of the control cabinet, check the operation status of the cooling fan, and ensure good module heat dissipation (module temperature rise ≤ 30 ℃ during high-frequency processing); Check the cleanliness of high-frequency cable joints to avoid dust affecting signal transmission.
-Parameter backup and calibration: Regularly (quarterly recommended) backup module configuration parameters and processing algorithm parameters, and store them in secure storage devices; Perform accuracy calibration on the module every six months, using a standard high-frequency signal generator to calibrate the acquisition accuracy, spectrum analysis accuracy, and synchronization accuracy of each channel. If the deviation exceeds the allowable range, it will be corrected through software calibration function; Calibration records should be properly stored for easy traceability.
Fault Handling Principles
When a module malfunctions, the principle of "checking the external first, then checking the internal; software first, then hardware" should be followed for handling:
-Firstly, check the power supply line (whether the voltage is normal, whether the positive and negative poles are reversed, whether the fuse is intact, and whether the EMI filter is normal), high-frequency input signal line (whether the cable is damaged, whether the joint is firm, whether the shielding layer is well grounded, and whether the impedance is matched), and communication/bus line (whether the network cable/fiber is intact, whether the terminal resistance is matched, and whether the shielding layer grounding is reliable) to eliminate external wiring faults;
-If there are no external abnormalities, use specialized software to check whether the module parameter configuration (sampling rate, filtering parameters, FFT parameters, triggering conditions, etc.) is correct, and try to download the parameters again or restore the default configuration; Check the communication protocol, IP address, and other settings between the upper computer and the module to verify if the communication link is unobstructed;
-If the above operation is ineffective, check the status of the module indicator light, locate the fault type based on the alarm information, and if necessary, contact Yokogawa Electric's professional technical personnel for maintenance or module replacement. Non professionals are prohibited from disassembling the module circuit board without authorization.
Safety precautions
-During installation, wiring, debugging, and maintenance, safety operating procedures must be strictly followed. Wiring or dismantling operations can only be carried out after disconnecting the power supply to avoid safety accidents caused by live working.
-It is strictly prohibited to connect the module to an AC power supply of 110-220V to avoid the power supply voltage exceeding the rated range and prevent the module from burning out.
-When used in areas with frequent lightning strikes, it is necessary to install specialized lightning protection devices at the incoming and outgoing terminals of the module to prevent damage to the module from lightning strikes.
-During the operation of the module, it is forbidden to touch live parts such as circuit boards and interface terminals to prevent electric shock or static electricity from damaging the equipment.
-During transportation and storage, the original packaging box must be used to avoid severe collisions and shaking. The storage environment must meet the requirements to prevent moisture and damage to the components.
Typical application scenarios
The YOKOGAWA SR1030B62-3MN * 1C high-frequency signal processor is widely used in industrial scenarios with strict requirements for high-frequency signal measurement and control, thanks to its wideband response, high-precision acquisition, real-time processing, and strong anti-interference ability
-In the field of precision manufacturing and equipment monitoring: used for high-frequency vibration signal acquisition and analysis of high-speed machine tools, spindles, rolling bearings and other equipment, identifying early equipment faults (such as wear, imbalance, misalignment) through FFT spectrum analysis, and achieving predictive maintenance of equipment; Adapt to high-frequency pressure signal measurement and control of high-speed stamping machines and injection molding machines to ensure machining accuracy.
-In the field of power electronics and new energy: used for high-frequency voltage/current signal acquisition and regulation of power electronic devices such as high-frequency inverters, frequency converters, SVG (Static Var Generator), real-time monitoring of the working status of power electronic devices, and optimization of equipment control strategies; Adapt to the high-frequency speed and vibration signal measurement and control of new energy vehicle motors, and improve the stability of motor operation.
-Aerospace and defense field: used for high-frequency vibration and impact signal testing of high-end equipment such as aircraft engines and missile launchers, collecting high-frequency signal data of equipment under different working conditions, and providing support for equipment performance optimization and reliability evaluation; Adapt high-frequency signal conditioning and processing for radar and communication equipment to ensure signal transmission quality.
-In the field of high-speed fluid and process measurement and control, it is used for the acquisition and processing of flow pulse signals for high-speed fluids (such as natural gas and crude oil) to achieve accurate measurement of high-speed fluid flow; Adapt to the measurement and control of high-frequency pressure and temperature fluctuation signals in chemical reaction processes, capture instantaneous changes in the reaction process, and optimize reaction process parameters.





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