GE IS200EACFG1B AC FE EX2100 Board
GE IS200EACFG1B AC FE EX2100 Board
Part Number IS200EACFG1B Manufacturer General Electric Country of Manufacture As Per GE Manufacturing Policy Series Mark VI/VIe Function Module Availability In StockThe IS200EACFG1B is an AC Feedback EX2100 Board developed by GE. The Exciter AC Feedback board (EACF) in the EX2100 Excitation Control measures the exciter PPT AC supply voltage and current. Application Data The phase voltage output from potential transformers is measured using voltage test rings TP1-4 as follows: Measure the Phase to Phase (or Line) Voltage AB between TP1 and TP2. Measure Phase to Phase Voltage BC between TP3 and TP4. Measure the Phase to Phase Voltage CA between TP4 and TP1. IS200EACFG1B Board Replacement Static-sensitive handling procedures should be implemented on all boards to prevent component damage caused by static electricity.
When handling boards or components, use a wrist grounding strap only after they have been removed from potentially electrified equipment and are at a normally grounded workplace. Static sensitive handling procedures should be implemented on all boards to prevent component damage caused by static electricity. When handling boards or components, use a wrist grounding strap only after they have been removed from potentially electrified equipment and are at a normally grounded workplace. Turn off the power to the exciter, then test the board for power before touching it or any related circuits to avoid electric shock. Remove, insert, or change board connections while power is provided to the equipment to avoid equipment damage.
The IO module has the following main functions
Input Function
The IO module can receive input signals sent by external devices and convert them into digital or analogue signals for use by the computer system or control system. These input signals can come from a variety of sensors, such as temperature sensors, pressure sensors, photosensitive sensors and so on. By receiving and parsing these input signals, the system can monitor and control the external environment in real time.
Output Functions
The IO module is capable of converting the output signals generated by a computer system or control system into the form required by an external device. These output signals are typically used to control actuators such as motors, valves, lights, etc. By sending appropriate output signals to external devices, the system enables control and operation of the external environment.
Data Acquisition and Processing
The IO module is capable of acquiring data from external devices and transferring it to a computer system or control system for further processing. This enables the system to acquire environmental data, status information and user inputs in real time and make appropriate decisions or perform specific tasks based on these data.
Communication Interfaces
IO modules are usually equipped with different types of communication interfaces, such as serial interfaces (RS232, RS485), Ethernet interfaces, CAN bus interfaces, and so on. These interfaces enable IO modules to exchange data and communicate efficiently with computer systems or other external devices.
OTHER INFORMATION
• Up to 1.26 GHz Pentium® III processor with 256 KB advanced transfer cache
• Up to 512 MB PC-133 SDRAM using a single SODIMM
• Internal AGP SVGA controller with 4 MB display cache
• 133 MHz system bus via Intel® 815E chipset
• Dual Ethernet controllers supporting 10BaseT and 100BaseTX interfaces
• Optional PCI dual channel Ultra160 SCSI
• Up to three (two with rear I/O support) PMC expansion sites (IEEE-P1386 common mezzanine card standard, 5 V)
• Up to 1 GB bootable flash on secondary IDE (optional)
• Two 16-bit and two 32-bit programmable timers
• 32 KB of nonvolatile SRAM
• Software-selectable watchdog timer with reset
• Remote Ethernet booting
• Optional IDE hard disk drive
• VME64 modes supported: A32/A24/D32/D16/D08(EO)/MBLT64/BLT32
• VMEbus interrupt handler, interrupter and system controller
• Includes real time endian conversion hardware for littleendian and big-endian data interfacing (patent no. 6,032,212)
• Enhanced bus error handling
• Passive heat sink
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