New materials: The general trend of localization is accelerating, and attention is paid to the leader of independent innovation materials

Semiconductor materials are mainly used in wafer manufacturing and chip packaging. The semiconductor industry has four characteristics: large industrial scale, multiple subdivisions, high technical threshold, and low cost ratio:

1) Large scale of industry: According to SEMI(Semiconductor Equipment and Materials Association) data statistics, the market size of the global semiconductor materials industry in 2018 reached 51.9 billion US dollars, corresponding to the global semiconductor industry scale of about 450 billion US dollars in 2018, and the semiconductor materials market size accounted for nearly 11.5%; The market size of manufacturing materials has reached 1.62 times of the market size of sealing and measuring materials.

2) Many subdivided industries: Semiconductor materials are the industry chain links with the most subdivided fields in the semiconductor industry chain, and wafer manufacturing materials include silicon wafers, photoresist, photoresist supporting reagents, wet electronic chemicals, electronic gases, CMP polishing materials, and targets; Chip packaging materials include packaging substrate, lead frame, resin, bonding wire, tin ball, and plating solution, etc. At the same time, similar wet electronic chemicals contain acids, alkalis and other reagents, as many as hundreds of fine molecule industry;

3) High technical threshold: the technical threshold of semiconductor materials is generally higher than that of other electronic and manufacturing related materials, which has high purity requirements and complex processes, and requires batch testing of the downstream corresponding production line in the research and development process. At the same time, the corresponding chip manufacturing process is different, and the downstream manufacturers have different requirements for the use of materials, resulting in the corresponding material parameters are also different;

4) Low cost ratio: Although the overall semiconductor material industry is large, due to the numerous subsectors of subdivided materials, a single subdivided material often accounts for a relatively low proportion of semiconductor production costs. Taking the target as an example, the proportion of the semiconductor target in the semiconductor material is about 3%, and the corresponding semiconductor production cost is only 3‰ to 5‰.

2.1 Raw material of photolithography -- photoresist

Photoresist, also known as photoresist, is a photosensitive mixed liquid composed of photoinitiator (including photosensitizer, photoacid-producing agent), photoresist resin, monomer (active diluent), solvent and other additives. It is a pattern transfer medium, which can transfer the mask pattern to the substrate by using different solubility after light reaction. At present, photoresist is widely used in the processing of micrographic circuits in the optoelectronic information industry, and is one of the key materials in the field of electronic manufacturing.

2.2 CMP polishing material

CMP (chemical mechanical polishing (ChemicalMechanicalPolishing) technology is one of the key process in semiconductor manufacturing process, using the "soft grinding hard" principle of wear, and play with a softer material for polishing to achieve the high quality of surface polishing. Through the comprehensive action of chemical and mechanical, the surface damage caused by simple mechanical polishing and the shortcomings of slow polishing speed, surface flatness and poor polishing consistency easily caused by simple chemical polishing are avoided.

CMP polishing materials mainly include polishing fluid, polishing pad, regulator, cleaner, etc., and their market shares account for 49%, 33%, 9% and 5% respectively. China's CMP polishing material market size in 2016 was 2.3 billion yuan, and the market is expected to reach 2.8 billion yuan in 2018.

At present, the polishing pad in the market is mainly monopolized by Dow Chemical Company, with a market share of about 90%, and other suppliers include Japan's Toray, 3M, Taiwan Tripartite Chemical, Cabot and other companies, with a total share of about 10%. In terms of polishing liquid, the main suppliers include Japan Fujimi, Japan HinomotoKenmazai, the United States Cabot, DuPont, Rodel, Eka, South Korea ACE and other companies, accounting for more than 90% of the global market share, the domestic market is mainly dependent on imports, only some domestic enterprises can produce.

Anji Microelectronics (Shanghai) Co., Ltd. produced copper/copper barrier layer polishing liquid, silica polishing liquid, TSV polishing liquid, silicon polishing liquid, copper polishing liquid and other products have successfully entered the domestic and foreign 8-inch and 12-inch customer chip production lines to use, copper/copper barrier layer polishing liquid products have entered the domestic and foreign leading technology node. Products cover 130nm~28nm technology nodes, product performance has reached the international leading level, and has a cost advantage, breaking the monopoly of foreign manufacturers in the field of high-end integrated circuit manufacturing polishing materials; Shanghai XinANA has made good progress in the development of abrasives for polishing fluid and memory polishing fluid. Copper polishing pad, oxide polishing pad and tungsten polishing pad developed by Hubei Dinglong Holding Co., Ltd. have begun downstream supply; The diamond dressing disc and retaining ring of Ningbo Jiangfeng Electronics have entered the evaluation and verification stage.